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Review of Health Prognostics and Condition Monitoring of Electronic Components

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dc.citedby31
dc.contributor.authorBhargava C.en_US
dc.contributor.authorSharma P.K.en_US
dc.contributor.authorSenthilkumar M.en_US
dc.contributor.authorPadmanaban S.en_US
dc.contributor.authorRamachandaramurthy V.K.en_US
dc.contributor.authorLeonowicz Z.en_US
dc.contributor.authorBlaabjerg F.en_US
dc.contributor.authorMitolo M.en_US
dc.contributor.authorid55641321100en_US
dc.contributor.authorid57219058518en_US
dc.contributor.authorid57198791439en_US
dc.contributor.authorid18134802000en_US
dc.contributor.authorid6602912020en_US
dc.contributor.authorid6602973655en_US
dc.contributor.authorid7004992352en_US
dc.contributor.authorid22234653100en_US
dc.date.accessioned2023-05-29T08:13:34Z
dc.date.available2023-05-29T08:13:34Z
dc.date.issued2020
dc.descriptionFailure (mechanical); Green manufacturing; Network components; Reliability analysis; Electronic component; Failure mechanism; Fault diagnosis technique; Health prognostics; Intelligent tools; Reliable electronics; Remaining useful life predictions; Residual lifetime; Condition monitoringen_US
dc.description.abstractTo meet the specifications of low cost, highly reliable electronic devices, fault diagnosis techniques play an essential role. It is vital to find flaws at an early stage in design, components, material, or manufacturing during the initial phase. This review paper attempts to summarize past development and recent advances in the areas about green manufacturing, maintenance, remaining useful life (RUL) prediction, and like. The current state of the art in reliability research for electronic components, mainly includes failure mechanisms, condition monitoring, and residual lifetime evaluation is explored. A critical analysis of reliability studies to identify their relative merits and usefulness of the outcome of these studies' vis-a-vis green manufacturing is presented. The wide array of statistical, empirical, and intelligent tools and techniques used in the literature are then identified and mapped. Finally, the findings are summarized, and the central research gap is highlighted. � 2013 IEEE.en_US
dc.description.natureFinalen_US
dc.identifier.ArtNo9075164
dc.identifier.doi10.1109/ACCESS.2020.2989410
dc.identifier.epage75183
dc.identifier.scopus2-s2.0-85084511007
dc.identifier.spage75163
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-85084511007&doi=10.1109%2fACCESS.2020.2989410&partnerID=40&md5=0cb381937caf7ef9db02b0cfadba5190
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/25734
dc.identifier.volume8
dc.publisherInstitute of Electrical and Electronics Engineers Inc.en_US
dc.relation.ispartofAll Open Access, Gold, Green
dc.sourceScopus
dc.sourcetitleIEEE Access
dc.titleReview of Health Prognostics and Condition Monitoring of Electronic Componentsen_US
dc.typeArticleen_US
dspace.entity.typePublication
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