Publication: Review of Health Prognostics and Condition Monitoring of Electronic Components
Date
2020
Authors
Bhargava C.
Sharma P.K.
Senthilkumar M.
Padmanaban S.
Ramachandaramurthy V.K.
Leonowicz Z.
Blaabjerg F.
Mitolo M.
Journal Title
Journal ISSN
Volume Title
Publisher
Institute of Electrical and Electronics Engineers Inc.
Abstract
To meet the specifications of low cost, highly reliable electronic devices, fault diagnosis techniques play an essential role. It is vital to find flaws at an early stage in design, components, material, or manufacturing during the initial phase. This review paper attempts to summarize past development and recent advances in the areas about green manufacturing, maintenance, remaining useful life (RUL) prediction, and like. The current state of the art in reliability research for electronic components, mainly includes failure mechanisms, condition monitoring, and residual lifetime evaluation is explored. A critical analysis of reliability studies to identify their relative merits and usefulness of the outcome of these studies' vis-a-vis green manufacturing is presented. The wide array of statistical, empirical, and intelligent tools and techniques used in the literature are then identified and mapped. Finally, the findings are summarized, and the central research gap is highlighted. � 2013 IEEE.
Description
Failure (mechanical); Green manufacturing; Network components; Reliability analysis; Electronic component; Failure mechanism; Fault diagnosis technique; Health prognostics; Intelligent tools; Reliable electronics; Remaining useful life predictions; Residual lifetime; Condition monitoring