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Simulation design for thermal model from various materials in electronic devices: A review

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dc.citedby1
dc.contributor.authorBahru R.en_US
dc.contributor.authorZamri M.F.M.A.en_US
dc.contributor.authorShamsuddin A.H.en_US
dc.contributor.authorMohamed M.A.en_US
dc.contributor.authorid57195836029en_US
dc.contributor.authorid57354218900en_US
dc.contributor.authorid35779071900en_US
dc.contributor.authorid57581478900en_US
dc.date.accessioned2023-05-29T09:40:36Z
dc.date.available2023-05-29T09:40:36Z
dc.date.issued2022
dc.descriptionElectronic equipment; Heat transfer performance; Thermography (temperature measurement); Device design; Electronics devices; Heat transfer performance; Property; Simulation Design; Simulation studies; Simulation;; Thermal management;; Thermal materials; Thermal model; Thermoelectric equipmenten_US
dc.description.abstractThe heat transfer performance in materials to remove heat is attained in various designs according to the devices� design. Simulation studies are comprising of heat transfer knowledge in detail suit the theories and applications. This review provides an understanding of the simulation work focusing on the heat transfer in the various design of electronic devices. This discussion begins with a briefing on the simulation principle and current focus. Then, the review continues by explaining various simulation methods that exhibit recent heat transfer analysis. The properties of simulation studies are also summarized in detail to understand the significant properties that impact analysis. The application of simulation in thermal model is looked forward to obtain significant heat transfer improvement and impactful research direction. This review also provides insights into challenges in simulation work with available opportunities to solve the heat transfer issue by understanding fundamental knowledge. � 2022 Taylor & Francis Group, LLC.en_US
dc.description.natureFinalen_US
dc.identifier.doi10.1080/10407782.2022.2083842
dc.identifier.epage665
dc.identifier.issue10
dc.identifier.scopus2-s2.0-85132176939
dc.identifier.spage640
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-85132176939&doi=10.1080%2f10407782.2022.2083842&partnerID=40&md5=760dd7ceb9bab3822bb783daa103b944
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/27182
dc.identifier.volume82
dc.publisherTaylor and Francis Ltd.en_US
dc.sourceScopus
dc.sourcetitleNumerical Heat Transfer; Part A: Applications
dc.titleSimulation design for thermal model from various materials in electronic devices: A reviewen_US
dc.typeReviewen_US
dspace.entity.typePublication
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