Publication: Simulation design for thermal model from various materials in electronic devices: A review
Date
2022
Authors
Bahru R.
Zamri M.F.M.A.
Shamsuddin A.H.
Mohamed M.A.
Journal Title
Journal ISSN
Volume Title
Publisher
Taylor and Francis Ltd.
Abstract
The heat transfer performance in materials to remove heat is attained in various designs according to the devices� design. Simulation studies are comprising of heat transfer knowledge in detail suit the theories and applications. This review provides an understanding of the simulation work focusing on the heat transfer in the various design of electronic devices. This discussion begins with a briefing on the simulation principle and current focus. Then, the review continues by explaining various simulation methods that exhibit recent heat transfer analysis. The properties of simulation studies are also summarized in detail to understand the significant properties that impact analysis. The application of simulation in thermal model is looked forward to obtain significant heat transfer improvement and impactful research direction. This review also provides insights into challenges in simulation work with available opportunities to solve the heat transfer issue by understanding fundamental knowledge. � 2022 Taylor & Francis Group, LLC.
Description
Electronic equipment; Heat transfer performance; Thermography (temperature measurement); Device design; Electronics devices; Heat transfer performance; Property; Simulation Design; Simulation studies; Simulation;; Thermal management;; Thermal materials; Thermal model; Thermoelectric equipment