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Optimization of reflow profile for copper pillar with SAC305 solder cap FCCSP

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dc.citedby1
dc.contributor.authorZainudin W.Z.Z.W.en_US
dc.contributor.authorYong T.C.en_US
dc.contributor.authorHui T.C.en_US
dc.contributor.authorKar Y.B.en_US
dc.contributor.authorHoong W.Y.en_US
dc.contributor.authorid58072690400en_US
dc.contributor.authorid16029485400en_US
dc.contributor.authorid55340767200en_US
dc.contributor.authorid58072938600en_US
dc.contributor.authorid58071699600en_US
dc.date.accessioned2024-10-14T03:21:39Z
dc.date.available2024-10-14T03:21:39Z
dc.date.issued2023
dc.description.abstractThe current trend of electrical devices development is progressing towards miniaturization, multi-function and high density, device integration and fine pitch in a smaller package size. This led to the invention of copper pillar bumps which acts as a connection between the dies to its corresponding substrate, which allows the fabrication of smaller semiconductor devices. The dies were mounted onto the substrate by undergoing mass reflow process where the SAC305 solder from the copper pillar bumps and substrate bumps will melt together and solidify to form a solder joint. The quality of the solder joint is influenced by the parameters that govern the reflow profile, which are ramp rate, soak time, time above liquidus time, peak temperature and cooling rate. If the reflow profile is not properly optimized, defects such as voids in the solder joint can pose a reliability issue for the packaged unit. Therefore, in this paper, ramp rate, soak time and time above liquidus of reflow profiles for die utilizing copper pillar bumps with SAC305 as its solder material was studied and optimized in finding the recommended range of each parameter of the reflow profiles that yield the least voiding in the solder joint. The experiment was conducted by varying the reflow profile parameter which are ramp rate, soak time and time above liquidus, which the solder joint cross section and X-ray images were then analysed to study its influences. Additional experiment that investigates flux outgassing rate of different flux activity levels and the influence of component standoff height and mis-alignment offset towards solder-creeping defect were conducted in this article. � 2023, The Author(s), under exclusive licence to Springer Science+Business Media, LLC, part of Springer Nature.en_US
dc.description.natureFinalen_US
dc.identifier.ArtNo187
dc.identifier.doi10.1007/s10854-022-09661-0
dc.identifier.issue3
dc.identifier.scopus2-s2.0-85146558827
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-85146558827&doi=10.1007%2fs10854-022-09661-0&partnerID=40&md5=3e8254b313a9ced2ee3b145dd8ec3519
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/34676
dc.identifier.volume34
dc.publisherSpringeren_US
dc.sourceScopus
dc.sourcetitleJournal of Materials Science: Materials in Electronics
dc.subjectChip scale packages
dc.subjectCopper
dc.subjectDefects
dc.subjectFlip chip devices
dc.subjectSoldering
dc.subject'current
dc.subjectCopper pillars
dc.subjectDevice development
dc.subjectElectrical devices
dc.subjectLiquidus
dc.subjectMiniaturisation
dc.subjectOptimisations
dc.subjectRamp-rate
dc.subjectSoak time
dc.subjectSolder joints
dc.subjectSubstrates
dc.titleOptimization of reflow profile for copper pillar with SAC305 solder cap FCCSPen_US
dc.typeArticleen_US
dspace.entity.typePublication
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