Publication:
Thermal conductivity and dielectric of solid glass microsphere and epoxy composite

dc.contributor.authorAhmad Amirun Aqil Ahmad Padhli
dc.date.accessioned2023-05-03T15:00:07Z
dc.date.available2023-05-03T15:00:07Z
dc.date.issued2020-02
dc.description.abstractThis thesis reports describes the thermal and dielectric of solid glass microsphere and epoxy composite. The main objectives of this thesis are to fabricate epoxy composite filled with Solid Glass Microsphere (SGM) composite with different ratio, measure the thermal conductivity and the dielectric of different ratio epoxy filled with Solid Glass Microsphere (SGM) composite and to optimize the ratio for thermal conductivity and dielectric of epoxy and Solid Glass Microsphere (SGM) composite. The both material will be mix together by following the ratio given in order to get a composite material with specific standard being follow by the testing machine. The ratio is starting from 100%, 90%, 80%, 70%, 60%, 50% and 40% (Epoxies) and the remaining is Solid Glass Microsphere (SGM). The composite will be put under thermal conductivity testing and AC breakdown testing (Dielectric) to observe the ratio that is more suitable and sustain. This testing is being conduct at laboratory and the lab instructor will do the testing because of the limited testing machine.en_US
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/20407
dc.subjectFull final thesis epoxy and solid glass microsphereen_US
dc.titleThermal conductivity and dielectric of solid glass microsphere and epoxy compositeen_US
dc.typeResource Types::text
dspace.entity.typePublication
oairecerif.author.affiliation#PLACEHOLDER_PARENT_METADATA_VALUE#
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