Publication: Thermal conductivity and dielectric of solid glass microsphere and epoxy composite
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Date
2020-02
Authors
Ahmad Amirun Aqil Ahmad Padhli
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Abstract
This thesis reports describes the thermal and dielectric of solid glass microsphere and
epoxy composite. The main objectives of this thesis are to fabricate epoxy composite
filled with Solid Glass Microsphere (SGM) composite with different ratio, measure
the thermal conductivity and the dielectric of different ratio epoxy filled with Solid
Glass Microsphere (SGM) composite and to optimize the ratio for thermal
conductivity and dielectric of epoxy and Solid Glass Microsphere (SGM) composite.
The both material will be mix together by following the ratio given in order to get a
composite material with specific standard being follow by the testing machine.
The ratio is starting from 100%, 90%, 80%, 70%, 60%, 50% and 40%
(Epoxies) and the remaining is Solid Glass Microsphere (SGM). The composite will
be put under thermal conductivity testing and AC breakdown testing (Dielectric) to
observe the ratio that is more suitable and sustain. This testing is being conduct at
laboratory and the lab instructor will do the testing because of the limited testing
machine.
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Full final thesis epoxy and solid glass microsphere