Publication:
Effect of reflow soldering process on metallurgical bonding between Sn3.5Ag solder and ENIG substrates

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dc.citedby0
dc.contributor.authorMuhammad N.A.en_US
dc.contributor.authorBais B.H.en_US
dc.contributor.authorAhmad I.en_US
dc.contributor.authorIsnin A.en_US
dc.contributor.authorid26531512000en_US
dc.contributor.authorid9638472600en_US
dc.contributor.authorid12792216600en_US
dc.contributor.authorid24338529400en_US
dc.date.accessioned2023-12-28T07:05:44Z
dc.date.available2023-12-28T07:05:44Z
dc.date.issued2011
dc.description.abstractReflow soldering process is one of the important steps in the manufacturing process for ball grid arrays. The purpose of this study is to observe the metallurgical bonding between Sn3.5Ag solder ball and electroless nickel immersion gold (ENIG) substrates after reflow soldering process. The reflow soldering process was performed at peak temperatures T peak of 246 and 251�C for 50 s by the rapid thermal processing system. Visual micrographs of these solder joints were performed in order to support the metallurgical bonding of Sn3.5Ag solder ball and ENIG substrate after the reflow soldering process. The formation of Ni 3Sn 4 intermetallic compounds (IMCs) at the Sn3.5Ag solder/Ni interface was dependent and continuous with one another compared to the initial IMC formation at Tpeak of ?246�C. It was also found that the initial IMCs thickness of Sn3.5Ag solder/Ni interface was lower and thinner at Tpeak of y251uC during the reflow soldering process. As a conclusion, the metallurgical bonding between Sn3?5Ag solder/ENIG substrate was formed better at T peak of ?251�C during the reflow soldering process using the rapid thermal processing system. � W. S. Maney & Son Ltd. 2011.en_US
dc.description.natureFinalen_US
dc.identifier.doi10.1179/143307511X13031890749253
dc.identifier.epageS216
dc.identifier.issueSUPPL. 2
dc.identifier.scopus2-s2.0-84055200085
dc.identifier.spageS213
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-84055200085&doi=10.1179%2f143307511X13031890749253&partnerID=40&md5=1d3dc0a81221ed493d68c8d0b457cafd
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/29592
dc.identifier.volume15
dc.pagecount3
dc.sourceScopus
dc.sourcetitleMaterials Research Innovations
dc.subjectElemental analysis
dc.subjectIntermetallic compounds
dc.subjectMetallurgical bonding
dc.subjectReflow profile
dc.subjectVisual micrograph
dc.subjectBall grid arrays
dc.subjectChemical analysis
dc.subjectFlip chip devices
dc.subjectIntermetallics
dc.subjectMetallurgy
dc.subjectRapid thermal annealing
dc.subjectRapid thermal processing
dc.subjectSilver
dc.subjectSoldering alloys
dc.subjectSubstrates
dc.subjectTin
dc.subjectElectroless nickel immersion gold
dc.subjectManufacturing process
dc.subjectMetallurgical bonding
dc.subjectPeak temperatures
dc.subjectReflow profile
dc.subjectReflow--soldering
dc.subjectSn3.5Ag solder
dc.subjectSolder joints
dc.subjectVisual micrograph
dc.subjectSoldering
dc.titleEffect of reflow soldering process on metallurgical bonding between Sn3.5Ag solder and ENIG substratesen_US
dc.typeConference paperen_US
dspace.entity.typePublication
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