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Effect of alumina trihydrate as additive on the mechanical properties of kenaf/polyester composite for plastic encapsulated electronic packaging application
(Elsevier Editora Ltda, 2020)
Atiqah A.
;
Ansari M.N.M.
;
Kamal M.S.S.
;
Jalar A.
;
Afeefah N.N.
;
Ismail N.
;
55366998300
;
55489853600
;
57224681830
;
11539926200
;
57221976593
;
55973059000
This paper mainly focuses on the suitability of using kenaf/polyester composites for potential plastic encapsulated electronic packaging. The usage of natural fiber, such as kenaf fiber which has been recognized as for green fiber is the potential substitute in plastic encapsulation composites. The use of microsized Alumina Trihydrate (ATH) as the additive in the formulations is to reduce the hygroscopic tendency of the composites. In this research, there are six compositions of the plastic encapsulation composites fabricated using hand lay-up followed by the vacuum infusion method. Moreover, the amount of additive of microsized ATH was varied (2.5, 5 and 7.5 wt%) in kenaf/polyester composites is also to observe the performance of mechanical properties such as tensile, flexural and impact strength. Then, evidence that the effect of microsized ATH additive had occurred between kenaf/polyester was identified by using Scanning Electron Microscope (SEM). The results revealed that the addition of microsized ATH at 5 wt% of kenaf/polyester composites improved slightly higher than unfilled ATH for the tensile and flexural strength by 1.7% and 2.13%. Also, the impact strength can reach up to 28% for 5 wt% ATH filled and the reduced water uptake was observed when increasing of microsized ATH content from 2.5 to 7.5 wt%. Thus, this suitability of microsized ATH as an additive could be a potential material used for plastic encapsulation for electronic packaging applications. � 2020 The Author(s).
22
Effect of Current Stressing on Mixed Solder Joint Resistance and Temperature
(Penerbit UTHM, 2024)
Zulkifli M.N.
;
Abdullah I.
;
Azam M.F.A.
;
Azhan N.H.
;
Ahmed A.
;
Jalar A.
;
36703431600
;
57224607172
;
59472980000
;
56652239100
;
59472471400
;
11539926200
This paper aims to investigate the impact of current stress on the electrical performance of mixed solder joints made of SnPb with SnCu and SnPb with SAC305. This information is currently missing and requires further research. The resistance of current-stressed pin-through-hole (PTH) solder joints, namely SnPb, SnCu, SAC305, and mixed solder joints of SnPb/SnCu and SnPb/SAC305, was measured using a micro-Ohm meter based on the Kelvin method. Temperature measurements were conducted by attaching two thermocouple probes to the solder joints. A microstructure examination was performed on the cross-section sample of PTH solder joints and further analyzed using open-source image processing software, ImageJ. It is noteworthy that fully mixing leaded and lead-free solder can reduce the variation of resistance during the application of current. The resistances of SnCu solder joints vary more compared to those of SAC305 joints with increasing applied current. Resistance variation of the SnPb/SnCu mixed solder joint is more dominant towards the SnPb solder joint trend, whereas SnPb/ SAC305 mixed solder joint is more dominant towards the SAC305 solder joint trend. The findings obtained from the ImageJ software analysis can be utilized to examine the evolution of microstructure and its correlation with the electrical properties of mixed solder joints. ? This is an open access article under the CC BY-NC-SA 4.0 license
5
Effect of nanofibril cellulose empty fruit bunch-reinforced thermoplastic polyurethane nanocomposites on tensile and dynamic mechanical properties for flexible substrates
(John Wiley and Sons Inc, 2024)
Azzra N.A.
;
Atiqah A.
;
Fadhlina H.
;
Jalar A.
;
Bakar M.A.
;
Ismail A.G.
;
Supian A.B.M.
;
58785621300
;
55366998300
;
57980228500
;
11539926200
;
6701558715
;
36672954400
;
57202962691
Researchers and scientists have focused on the development and future opportunities of flexible sensors in food, environment and defense fields. In this study, we propose a flexible substrate material-based nanofibril cellulose empty fruit bunch (NEFB)-reinforced thermoplastic polyurethane (TPU) blend nanocomposite for flexible substrate materials. Untreated and treated nanofibril cellulose samples of empty fruit bunch (NEFB, 0, 1, 2, 3, 4 wt. %) were treated with 6 wt.% sodium hydroxide (NaOH) and subjected to internal Brabender mixer followed by a hot-pressing machine. The density and tensile and dynamic mechanical properties of the nanocomposites were investigated for the treated and untreated samples. Tensile properties were characterized using a Universal Testing Machine, and the fracture mechanism after post-tensile testing was determined by scanning electron microscopy (SEM). Increasing the content of untreated NEFB/TPU improved the tensile strength compared with 6% treated NEFB/TPU blend nanocomposites. Incorporating the nanofibril cellulose of empty fruit bunch at 2% into the TPU blend nanocomposites significantly increased E?, E" and Tg compared with other formulations. Highlights: Nanocellulose derived from plants is considered a promising material for flexible substrates in electronics due to its robust mechanical properties and eco-friendliness. Malaysia's abundant empty fruit bunch (EFB) resources make it a possible source of nanocellulose, which improves the properties of polymers. The effect of sodium hydroxide (NaOH) treatment on the compatibility of EFB-derived nanocellulose with polymer matrices was investigated. The addition of nanocellulose, particularly at a concentration of 1%, significantly increases the tensile strength of thermoplastic polyurethane nanocomposites, whereas 6% NaOH treatment has no effect. Dynamic mechanical analysis reveals high storage modulus at 2% nanofibril cellulose empty fruit bunch (NEFB) and energy dissipation at 4% NEFB as well as enhanced interfacial bonding at 1% NEFB. ? 2024 Society of Plastics Engineers.
9
Effect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA)
(2008)
Kornain Z.
;
Amin N.
;
Jalar A.
;
Cheah A.Y.
;
Ahmad I.
;
24341024000
;
7102424614
;
11539926200
;
26632778200
;
12792216600
Electrically conductive adhesive (ECA) is a popular alternative to replace lead solder interconnect material in most areas of electronic packaging. ECA mainly consists of an organic/polymeric binder matrix and metal filler. These composite materials provide both physical adhesion and electrical conductivity. Compared to the solder technology, ECA offers numerous advantages, such as environmental friendliness, lower processing temperature, fewer processing steps (reducing processing cost), and especially, the fine pitch capability attributed to the availability of small sized conductive fillers. Here, 70-nm sized silver particle filler (Ag) has been used to study the effect to electrical conductivity of ECA after surface treatment. Upon surface treatment of silver with silane-based coupling agent, the treated silver filled epoxy system demonstrated incredible improvement in electrical properties. The current conductivity (DC) for treated filler was 4.01 S/cm compared with untreated filler with 4.54E-03 S/cm for 5%w filler loading. Morphological studies using light microscopy micrographs have shown perceptible enhancement in filler dispersivity after treatment. �2008 IEEE.
4
Micromechanical and microstructure evolution of leaded (SnPb) and lead-free (SAC305 and SnCu) mixed solder joints during isothermal aging
(Taylor and Francis Ltd., 2024)
Zulkifli M.N.
;
Abdullah I.
;
Azhan N.H.
;
Jalar A.
;
36703431600
;
57224607172
;
56652239100
;
11539926200
This paper studies how isothermal aging affects the micromechanical and structural properties of mixed solder joints made of 60Sn-40Pb (SnPb) with Sn-3.0Ag-0.5Cu (SAC305) and SnPb with Sn-0.7Cu (SnCu). The nanoindentation test was done to measure the micromechanical properties of SnPb/SAC305 and SnPb/SnCu mixed solder joints. These properties are hardness, reduced modulus, and stress exponent. Scanning electron microscopy (SEM) was used to look at the microstructure of a cross-section of mixed solder joints. The micrographs that were taken were then examined with open-source image processing software called ImageJ. It was found that the rate and distribution of intermetallic compound (IMC) formation and the reduction of Sn-rich phase grain size affect how the hardness and stress exponent values of mixed solder joints change after 1000 h of high temperature storage (HTS). ImageJ analysis shows that the Pb-rich phase particle count and distribution can be used to figure out how mixed solder joints respond to indentation creep and how that relates to isothermal aging. Using ImageJ, it?s clear that the indentation creep behavior of the GBS mechanism of an as soldered SnPb/SnCu mixed solder joint is caused by the highest number and size of Pb-rich phase particles that are not well distributed across the dendritic area of Sn-rich phase grain boundaries. ? 2024 Informa UK Limited, trading as Taylor & Francis Group.
1
Morphology and optical properties of nickel oxide nanostructure from aqueous solution
(2012)
Hamid M.A.A.
;
Bakar M.A.
;
Jalar A.
;
Shamsudin R.
;
Ahmad I.
;
55417659700
;
6701558715
;
11539926200
;
6507783528
;
12792216600
In this paper, porous flower-like nickel oxide (NiO) on glass substrates were prepared by an aqueous chemical growth based technique. The morphology and optical observed were found to be influence by the reaction time. Field Emission Scanning Electron Microscopy (FESEM) revealed a porous flower-like structure growth on the substrates investigated. The optical band gap for NiO thin film calculated from transmission spectra has increased from 3.72 eV to 3.91 eV with the increasing of reaction time. This result shows that the growth time have some influence on morphology and optical of NiO films.
6
Sustainable substrate tin oxide/nanofibril cellulose/thermoplastic starch: dimensional stability and tensile properties
(Elsevier Editora Ltda, 2023)
Azra N.A.
;
Atiqah A.
;
Jalar A.
;
Manar G.
;
Supian A.B.M.
;
Ilyas R.A.
;
58974255800
;
55366998300
;
11539926200
;
55982931800
;
57202962691
;
57196328367
Polymers used in thin films or substrates contribute to several environmental issues hence biodegradable materials should be used instead. In order to overcome this issue, the use of sustainable filler and reinforcements are needed to replace the existing synthetic materials. Nevertheless, the lower mechanical properties and higher water absorption could be hindered by incorporating Tin oxide (SnO) in nanofibril cellulose reinforced thermoplastic starch (NCF/TPS). In this study, different content of SnO (0, 1, 2, 3, 4, and 5 wt.%) with NCF/TPS nanocomposites was prepared by stir casting methods. The characterisation in terms of dimensional stability (density, water absorption, and thickness swelling) and tensile properties were studied. From the finding, it was found that the highest content of SnO leads to the lowest density, water absorption, and thickness swelling properties of SnO/NCF/TPS blend nanocomposites. Moreover, the incorporation of SnO at 4 wt.% shows good tensile properties than other formulations of SnO/NCF/TPS. � 2023 The Author(s)
34

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