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Effect of alumina trihydrate as additive on the mechanical properties of kenaf/polyester composite for plastic encapsulated electronic packaging application
(Elsevier Editora Ltda, 2020)
Atiqah A.
;
Ansari M.N.M.
;
Kamal M.S.S.
;
Jalar A.
;
Afeefah N.N.
;
Ismail N.
;
55366998300
;
55489853600
;
57224681830
;
11539926200
;
57221976593
;
55973059000
This paper mainly focuses on the suitability of using kenaf/polyester composites for potential plastic encapsulated electronic packaging. The usage of natural fiber, such as kenaf fiber which has been recognized as for green fiber is the potential substitute in plastic encapsulation composites. The use of microsized Alumina Trihydrate (ATH) as the additive in the formulations is to reduce the hygroscopic tendency of the composites. In this research, there are six compositions of the plastic encapsulation composites fabricated using hand lay-up followed by the vacuum infusion method. Moreover, the amount of additive of microsized ATH was varied (2.5, 5 and 7.5 wt%) in kenaf/polyester composites is also to observe the performance of mechanical properties such as tensile, flexural and impact strength. Then, evidence that the effect of microsized ATH additive had occurred between kenaf/polyester was identified by using Scanning Electron Microscope (SEM). The results revealed that the addition of microsized ATH at 5 wt% of kenaf/polyester composites improved slightly higher than unfilled ATH for the tensile and flexural strength by 1.7% and 2.13%. Also, the impact strength can reach up to 28% for 5 wt% ATH filled and the reduced water uptake was observed when increasing of microsized ATH content from 2.5 to 7.5 wt%. Thus, this suitability of microsized ATH as an additive could be a potential material used for plastic encapsulation for electronic packaging applications. � 2020 The Author(s).
Effect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA)
(2008)
Kornain Z.
;
Amin N.
;
Jalar A.
;
Cheah A.Y.
;
Ahmad I.
;
24341024000
;
7102424614
;
11539926200
;
26632778200
;
12792216600
Electrically conductive adhesive (ECA) is a popular alternative to replace lead solder interconnect material in most areas of electronic packaging. ECA mainly consists of an organic/polymeric binder matrix and metal filler. These composite materials provide both physical adhesion and electrical conductivity. Compared to the solder technology, ECA offers numerous advantages, such as environmental friendliness, lower processing temperature, fewer processing steps (reducing processing cost), and especially, the fine pitch capability attributed to the availability of small sized conductive fillers. Here, 70-nm sized silver particle filler (Ag) has been used to study the effect to electrical conductivity of ECA after surface treatment. Upon surface treatment of silver with silane-based coupling agent, the treated silver filled epoxy system demonstrated incredible improvement in electrical properties. The current conductivity (DC) for treated filler was 4.01 S/cm compared with untreated filler with 4.54E-03 S/cm for 5%w filler loading. Morphological studies using light microscopy micrographs have shown perceptible enhancement in filler dispersivity after treatment. �2008 IEEE.
Morphology and optical properties of nickel oxide nanostructure from aqueous solution
(2012)
Hamid M.A.A.
;
Bakar M.A.
;
Jalar A.
;
Shamsudin R.
;
Ahmad I.
;
55417659700
;
6701558715
;
11539926200
;
6507783528
;
12792216600
In this paper, porous flower-like nickel oxide (NiO) on glass substrates were prepared by an aqueous chemical growth based technique. The morphology and optical observed were found to be influence by the reaction time. Field Emission Scanning Electron Microscopy (FESEM) revealed a porous flower-like structure growth on the substrates investigated. The optical band gap for NiO thin film calculated from transmission spectra has increased from 3.72 eV to 3.91 eV with the increasing of reaction time. This result shows that the growth time have some influence on morphology and optical of NiO films.
Sustainable substrate tin oxide/nanofibril cellulose/thermoplastic starch: dimensional stability and tensile properties
(Elsevier Editora Ltda, 2023)
Azra N.A.
;
Atiqah A.
;
Jalar A.
;
Manar G.
;
Supian A.B.M.
;
Ilyas R.A.
;
58974255800
;
55366998300
;
11539926200
;
55982931800
;
57202962691
;
57196328367
Polymers used in thin films or substrates contribute to several environmental issues hence biodegradable materials should be used instead. In order to overcome this issue, the use of sustainable filler and reinforcements are needed to replace the existing synthetic materials. Nevertheless, the lower mechanical properties and higher water absorption could be hindered by incorporating Tin oxide (SnO) in nanofibril cellulose reinforced thermoplastic starch (NCF/TPS). In this study, different content of SnO (0, 1, 2, 3, 4, and 5 wt.%) with NCF/TPS nanocomposites was prepared by stir casting methods. The characterisation in terms of dimensional stability (density, water absorption, and thickness swelling) and tensile properties were studied. From the finding, it was found that the highest content of SnO leads to the lowest density, water absorption, and thickness swelling properties of SnO/NCF/TPS blend nanocomposites. Moreover, the incorporation of SnO at 4 wt.% shows good tensile properties than other formulations of SnO/NCF/TPS. � 2023 The Author(s)

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