SCOPUS

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SCOPUS

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An empirical study of knowledge management processes in small and medium enterprises
(International Business Information Management Association, IBIMA, 2008)
Daud S.
;
Yusuf W.F.W.
;
13906794000
;
56069533200
The competitiveness of small and medium enterprises depends on the quality of knowledge they apply to their business processes. Knowledge management processes are part of the organization business processes. These processes are essential or the precondition for effective knowledge management. Knowledge management processes comprised of knowledge acquisition, conversion, application, and protection. These processes require turning personal knowledge into corporate knowledge that can be widely shared throughout an organization and appropriately applied. It is a conscious strategy of getting the right knowledge to the right people at the right time and helping people share and put information into action to improve organizational performance. There are very limited empirical studies on knowledge management processes in small and medium enterprises particularly in Malaysia. In order to reduce the research gap, this study examines how small and medium enterprises apply knowledge management processes in their daily business activities and analyze the relationship between knowledge management processes and organizational performance. With an effective knowledge management processes, small and medium enterprises should be able to come up with innovative products and services to ensure their competitiveness and sustainability of performance.
Ultra fine pitch 20 micron 2N second bond improvement with new capillary surface morphology
(2008)
Nor N.H.M.
;
Taib S.
;
Ahmad I.
;
Abdullah H.
;
57219925855
;
26633364600
;
12792216600
;
26025061200
Wire bonding of 20micron 2N wire using conventional pink capillary for ultra Fine Pitch package results in high stoppages of short tail which causes machine to stop, higher yield loss and reduced equipment efficiency and stability. The objective of present study is to improve the 2nd bond quality and stability for reducing the stoppages caused by the short tail. The new design, called as Fortus capillaries have granular tip surface morphology that improves mechanical interlocking, relative displacement between capillary's tip and wire, and also improve the energy transfer efficiency at wire-lead inter layer surface. Statistical analysis comparisons and internal physical inspection were done through SEM image at 0 hour, 96 hours and 192 hours after High Temperature Storage (HTS) and 500 and 1000x Thermal cycle. Cross section analysis was also done to study the Inter Metallic Compound (IMC) formation between wire and lead plating. The Fortus pink capillary effectiveness in reducing short tail was proven in actual production during 5000 unit wire bond process operation with 75% improvement of machine stoppages and resulting in significant improvement of production yield up to 99.5%. This new granular tip capillary also gave about 100% improvement compared to the conventional capillaries life �2008 IEEE.
A study on static voltage collapse proximity indicators
(2008)
Verayiah R.
;
Abidin I.Z.
;
26431682500
;
35606640500
In the time of rapid growth, there is an increase of demand for a reliable and stable power supply. Due to this, utility companies are forced to operate their power system nearer to its maximum capabilities since system expansion may be a costly option. As a result, the power system will be at risk to voltage collapse. Voltage collapse phenomenon is known to be complex and localised in nature but with a widespread effect. The ultimate effect of voltage collapse would be total system collapse which would incur high losses to utility companies. Thus, online monitoring of power system stability has become a vital factor for electric utility companies.This paper looks into combining a power flow program in MATLAB environment with two line stability indices, which are Fast Voltage Stability Index (FVSI) and Line Stability Index, LQP for automatic contingency ranking. The IEEE 14 Bus Test System is used as a standard test system. This approach investigates each line of the system through calculating an indicator that varies from zero (no load condition) to unity (maximum permissible loading condition). The basic concept of maximum power transfer through a line is utilized. Correlation study on the results obtained from contingency ranking and voltage stability analysis were conducted and it is found that line outages at the weak lines would cause voltage instability condition to a system. Subsequently, using the result from the contingency ranking, weak areas in the system can be identified. Verification of this technique with other existing technique shows a strong agreement between them. �2008 IEEE.
Applications of high-resolution schemes based on normalized variable formulation for 3D indoor airflow simulations
(2008)
Ng K.C.
;
Ng E.Y.K.
;
Yusoff M.Z.
;
Lim T.K.
;
55310814500
;
7201647536
;
7003976733
;
23668285700
Computational fluid dynamics (CFD) has been used in a routine manner for the design of indoor environments. The quality of these CFD studies varies from poor to excellent, and only in year 2003 S�rensen and Nielsen recommend a detailed guideline on imposing quality control in the CFD-related works for indoor airflow simulations. One of these recommendations is to use monotone high-resolution (HR) schemes that apply flux limiters to ensure solution boundedness while preserving the high-order accuracy of the differencing schemes. In this paper, based on the ?-formulations derived from the normalized variable formulation, four recently developed HR schemes, GAMMA, CUBISTA, AVLSMART and HOAB, are applied to several indoor airflow problems such as (1) Smith-Hutton problem (dead-end channel); (2) forced convection problem (horizontal/oblique inflow) in a parallelepiped room; (3) mixing ventilation problem focusing on the prediction of local mean age of air; (4) flow in a two-room chamber with internal partition and (5) displacement ventilation in a mockup office. Based on the flow results, the aspects of accuracy and robustness of these HR schemes are addressed for appropriate selection of an 'ideal' differencing scheme to improve the quality of 3D indoor CFD calculations. Copyright � 2007 John Wiley & Sons, Ltd.
Improved series resistance model for CMOS ESD diodes
(2008)
Kamal N.B.
;
Kordesch A.V.
;
Ahmad I.B.
;
26633062900
;
22934876900
;
12792216600
Compact diode models normally available in commercial simulators like Spectre or HSPICE do not scale the series resistance with P-N distance. The standard diode models scale with drawn area, assuming the current is vertical. However the diodes used for ESD protection in CMOS are operating as lateral diodes, so the resistance should scale with width, not area. This is a serious problem for circuit designers. Accurate series resistance in the diode forward region is critical especially for designing ESD protection circuits. This paper analyzes the effect of diode width and P to N (P active to N-tap active) distance on the extracted model Rs value in the standard level 3 SPICE diode model. Diodes of various widths and P-N distance were designed and fabricated in a CMOS 130 nm technology to get actual data measurements. Parameter extraction was done using the commercial BSIMProPlus model extraction software. Different diode widths and P-N distances produce forward IV curves with different slope, due to the changing series resistance. The slope represents the incremental series resistance. This study has been done with two types of diode, PN diode (P active in Nwell diode) and NP diode (N active in Pwell diode). The extracted Rs value shows a linear relationship to P-N distance and is proportional to inverse drawn width. � 2008 IEEE.

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