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Numerical simulation of heat transfer enhancement in wavy microchannel heat sink

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dc.citedby269
dc.contributor.authorMohammed H.A.en_US
dc.contributor.authorGunnasegaran P.en_US
dc.contributor.authorShuaib N.H.en_US
dc.contributor.authorid15837504600en_US
dc.contributor.authorid35778031300en_US
dc.contributor.authorid13907934500en_US
dc.date.accessioned2023-12-29T07:49:31Z
dc.date.available2023-12-29T07:49:31Z
dc.date.issued2011
dc.description.abstractIn this paper, heat transfer and water flow characteristics in wavy microchannel heat sink (WMCHS) with rectangular cross-section with various wavy amplitudes ranged from 125 to 500. ?m is numerically investigated. This investigation covers Reynolds number in the range of 100 to 1000. The three-dimensional steady, laminar flow and heat transfer governing equations are solved using the finite-volume method (FVM). The water flow field and heat transfer phenomena inside the heated wavy microchannels is simulated and the results are compared with the straight microchannels. The effect of using a wavy flow channel on the MCHS thermal performance, the pressure drop, the friction factor, and wall shear stress is reported in this article. It is found that the heat transfer performance of the wavy microchannels is much better than the straight microchannels with the same cross-section. The pressure drop penalty of the wavy microchannels is much smaller than the heat transfer enhancement achievement. Both friction factor and wall shear stress are increased proportionally as the amplitude of wavy microchannels increased. � 2010 Elsevier Ltd.en_US
dc.description.natureFinalen_US
dc.identifier.doi10.1016/j.icheatmasstransfer.2010.09.012
dc.identifier.epage68
dc.identifier.issue1
dc.identifier.scopus2-s2.0-78650299874
dc.identifier.spage63
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-78650299874&doi=10.1016%2fj.icheatmasstransfer.2010.09.012&partnerID=40&md5=c713e609b1c39ecfe540edd49c5255ae
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/30563
dc.identifier.volume38
dc.pagecount5
dc.sourceScopus
dc.sourcetitleInternational Communications in Heat and Mass Transfer
dc.subjectHeat transfer enhancement
dc.subjectMicrochannel heat sink (MCHS)
dc.subjectPressure drop
dc.subjectWavy microchannels
dc.subjectFlow of water
dc.subjectFriction
dc.subjectHeat sinks
dc.subjectHeat transfer coefficients
dc.subjectHydraulics
dc.subjectLaminar flow
dc.subjectPressure drop
dc.subjectPressure effects
dc.subjectReynolds number
dc.subjectShear stress
dc.subjectStrength of materials
dc.subjectWalls (structural partitions)
dc.subjectFlow and heat transfer
dc.subjectFriction factors
dc.subjectGoverning equations
dc.subjectHeat Transfer enhancement
dc.subjectHeat transfer performance
dc.subjectMicro channel heat sinks
dc.subjectMicrochannel heat sink (MCHS)
dc.subjectNumerical simulation
dc.subjectRectangular cross-sections
dc.subjectThermal Performance
dc.subjectTransfer phenomenon
dc.subjectWall shear stress
dc.subjectWater flows
dc.subjectWavy flow
dc.subjectWavy microchannels
dc.subjectMicrochannels
dc.titleNumerical simulation of heat transfer enhancement in wavy microchannel heat sinken_US
dc.typeArticleen_US
dspace.entity.typePublication
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