Publication:
Comparison of TAPS packages for engineering

dc.citedby1
dc.contributor.authorSidhu S.M.en_US
dc.contributor.authorid56259597000en_US
dc.date.accessioned2023-12-29T07:56:20Z
dc.date.available2023-12-29T07:56:20Z
dc.date.issued2008
dc.description.abstractPurpose - This paper aims to present the development of technology-assisted problem solving (TAPS) packages at University Tenaga Nasional (UNITEN). The project is the further work of the development of interactive multimedia based packages targeted for students having problems in understanding the subject of engineering mechanics dynamics. Design/methodology/approach - In this study TAPS packages are compared with other selected engineering computer packages. Findings - The differences found were indicative of better presentation and clarity, step-by-step approach to solve engineering problems, user-friendly environment, unbiased assessment of performance and flexibility to incorporate 3-D geometric models in the TAPS packages. Originality/value - This paper provides a brief account of the differences between the TAPS packages approach used in this research with that of commercial simulation packages accompanying the engineering mechanics dynamics textbook and will be of interest to those in the field of engineering. � Emerald Group Publishing Limited.en_US
dc.description.natureFinalen_US
dc.identifier.doi10.1108/10650740810886330
dc.identifier.epage175
dc.identifier.issue3
dc.identifier.scopus2-s2.0-45749136388
dc.identifier.spage161
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-45749136388&doi=10.1108%2f10650740810886330&partnerID=40&md5=50469e884dceb21d8c3d1a6525987d18
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/30945
dc.identifier.volume25
dc.pagecount14
dc.sourceScopus
dc.sourcetitleCampus-Wide Information Systems
dc.subjectCivil engineering
dc.subjectElectrical engineering
dc.subjectMalaysia
dc.subjectProblem solving
dc.subjectSoftware tools
dc.subjectStudents
dc.titleComparison of TAPS packages for engineeringen_US
dc.typeArticleen_US
dspace.entity.typePublication
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