Publication:
Thermal stress test for PLED

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dc.citedby0
dc.contributor.authorYap B.K.en_US
dc.contributor.authorKoh S.P.en_US
dc.contributor.authorTiong S.K.en_US
dc.contributor.authorOng C.N.en_US
dc.contributor.authorid26649255900en_US
dc.contributor.authorid22951210700en_US
dc.contributor.authorid15128307800en_US
dc.contributor.authorid36570734800en_US
dc.date.accessioned2023-12-29T07:51:59Z
dc.date.available2023-12-29T07:51:59Z
dc.date.issued2010
dc.description.abstractThis work presents thermal stability studies of PLEDs involving the comparison of electrical performance before and after thermal treatment. Two cycles of continuous thermal stress test from room temperature to 100 deg Celsius did not significantly affect the total photoluminescence intensity from the light-emitting polymer in the PLED suggesting that the layer of light-emitting polymer is intact. However, the rapid degradation of the electrical performance of the PLED right after the first cycle of thermal stress test suggests that the electrodes have degraded hence hindering charge injection into the polymeric layer. � 2010 IEEE.en_US
dc.description.natureFinalen_US
dc.identifier.ArtNo5549354
dc.identifier.doi10.1109/SMELEC.2010.5549354
dc.identifier.epage372
dc.identifier.scopus2-s2.0-77957592541
dc.identifier.spage370
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-77957592541&doi=10.1109%2fSMELEC.2010.5549354&partnerID=40&md5=78e606b8f2e2705847d3fc5677a6c617
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/30725
dc.pagecount2
dc.sourceScopus
dc.sourcetitleIEEE International Conference on Semiconductor Electronics, Proceedings, ICSE
dc.subjectLight emission
dc.subjectThermal stress
dc.subjectThermoelasticity
dc.subjectBefore and after
dc.subjectElectrical performance
dc.subjectFirst cycle
dc.subjectLight emitting polymer
dc.subjectPhotoluminescence intensities
dc.subjectPolymeric layers
dc.subjectRapid degradation
dc.subjectRoom temperature
dc.subjectThermal stability studies
dc.subjectThermal treatment
dc.subjectPolymers
dc.titleThermal stress test for PLEDen_US
dc.typeConference paperen_US
dspace.entity.typePublication
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