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Insulated Cu wire free air ball characterization

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dc.citedby2
dc.contributor.authorLeong H.en_US
dc.contributor.authorYap B.en_US
dc.contributor.authorKhan N.en_US
dc.contributor.authorIbrahim M.R.en_US
dc.contributor.authorTan L.C.en_US
dc.contributor.authorid55787052600en_US
dc.contributor.authorid26649255900en_US
dc.contributor.authorid9736201900en_US
dc.contributor.authorid16021986000en_US
dc.contributor.authorid57661553500en_US
dc.date.accessioned2023-05-16T02:47:03Z
dc.date.available2023-05-16T02:47:03Z
dc.date.issued2014
dc.description.abstractInsulated Cu wire technology has immense potential for fine pitch wire bonding interconnection. Understanding the behavior of the insulated Cu free air ball (FAB) formation is crucial for wire bonding process. The FAB formation, size, shape and cleanliness under different conditions for 20 ?m insulated Cu wire were investigated using SEM, FESEM and FTIR surface analysis. The results were compared with that of bare Cu wire. Consistently spherical residue free FAB of insulated Cu wire were formed using forming gas. The samples with insulated Cu wire consistently produced larger FAB than that of bare Cu wire, indicating that the energy required for free air ball formation is lower. Basic bonding performances in terms of ball bond strength, intermetallic (IMC) coverage growth and stitch bond strength of insulated Cu wire at time zero are also discussed in the paper. © 2014 Elsevier Ltd. All rights.en_US
dc.description.natureFinalen_US
dc.identifier.doi10.1016/j.microrel.2014.03.015
dc.identifier.epage1574
dc.identifier.issue8
dc.identifier.scopus2-s2.0-84905909926
dc.identifier.spage1567
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-84905909926&doi=10.1016%2fj.microrel.2014.03.015&partnerID=40&md5=b4f29a47a122c65783794b7d74456473
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/22061
dc.identifier.volume54
dc.publisherElsevier Ltden_US
dc.sourceScopus
dc.sourcetitleMicroelectronics Reliability
dc.titleInsulated Cu wire free air ball characterizationen_US
dc.typeArticleen_US
dspace.entity.typePublication
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