Publication:
Recent advances on thermally conductive adhesive in electronic packaging: A review

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dc.citedby8
dc.contributor.authorAlim M.D.en_US
dc.contributor.authorAbdullah M.Z.en_US
dc.contributor.authorAziz M.S.A.en_US
dc.contributor.authorKamarudin R.en_US
dc.contributor.authorGunnasegaran P.en_US
dc.contributor.authorid57527077400en_US
dc.contributor.authorid31567537400en_US
dc.contributor.authorid36695908700en_US
dc.contributor.authorid57215578097en_US
dc.contributor.authorid35778031300en_US
dc.date.accessioned2023-05-29T09:05:47Z
dc.date.available2023-05-29T09:05:47Z
dc.date.issued2021
dc.descriptionAdhesives; Electronics packaging; Fillers; Nanocomposites; Nanoparticles; Temperature control; Bonding strength; Conductive fillers; Electronic Packaging; Epoxy adhesives; Epoxy-based; Nano composite; Thermal; Thermally conductive adhesive; Thermally conductive adhesives; Thermal conductivityen_US
dc.description.abstractThe application of epoxy adhesive is widespread in electronic packaging. Epoxy adhesives can be integrated with various types of nanoparticles for enhancing thermal conductivity. The joints with thermally conductive adhesive (TCA) are preferred for research and advances in thermal management. Many studies have been conducted to increase the thermal conductivity of epoxy-based TCAs by conductive fillers. This paper reviews and summarizes recent advances of these available fillers in TCAs that contribute to electronic packaging. It also covers the challenges of using the filler as a nano-composite. Moreover, the review reveals a broad scope for future research, particularly on thermal management by nanoparticles and improving bonding strength in electronic packaging. � 2021 by the authors. Licensee MDPI, Basel, Switzerland.en_US
dc.description.natureFinalen_US
dc.identifier.ArtNo3337
dc.identifier.doi10.3390/polym13193337
dc.identifier.issue19
dc.identifier.scopus2-s2.0-85117409843
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-85117409843&doi=10.3390%2fpolym13193337&partnerID=40&md5=2bc60e9ff402ff75f3fa7ad20b37d5de
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/25960
dc.identifier.volume13
dc.publisherMDPIen_US
dc.relation.ispartofAll Open Access, Gold, Green
dc.sourceScopus
dc.sourcetitlePolymers
dc.titleRecent advances on thermally conductive adhesive in electronic packaging: A reviewen_US
dc.typeReviewen_US
dspace.entity.typePublication
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