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Comparison study on reliability performance for polymer core solder balls under multiple reflow and HTS stress tests

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dc.citedby3
dc.contributor.authorKar Y.B.en_US
dc.contributor.authorHui T.C.en_US
dc.contributor.authorAgileswari R.en_US
dc.contributor.authorLo C.en_US
dc.contributor.authorid26649255900en_US
dc.contributor.authorid55340767200en_US
dc.contributor.authorid16023154400en_US
dc.contributor.authorid55340865500en_US
dc.date.accessioned2023-12-28T04:13:12Z
dc.date.available2023-12-28T04:13:12Z
dc.date.issued2013
dc.description.abstractDrop ball reliability for Ball Grid Array (BGA) package on lead-free product is a major reliability concern. Integrating a polymer core in the solder ball could be a good strategy to dissipate stress better compared to the purely metallic solder ball. However, the diffusion rate of the copper is much faster than the diffusion rate of the solder. Hence, Kirkendall voids starts forming and causing crack between the interface of copper and solder. This could affect the solder joint as well as the solder ball drop reliability especially when subjected to high temperature stress. The new polymer core solder ball with 1 ?m thickness of nickel (Ni) coated on the copper (polymer core/copper/nickel/solder) could offer better solder ball joint and drop reliability performance. This work studies the effects of IMC growth, solder ball shear strength and drop test reliability. Subsequently, the failure modes were observed after multiple reflow (up to 5 times) and HTS stress tests. The IMC formation was observed under the high power scope with magnification 50� via the mechanical cross-section and was measured using an analytical software tool. Solder ball shear test was carried out to measure the solder joint performance after multiple reflow and HTS stress tests via the Dage 4000 series bond tester. Drop reliability test was carried out via the packing drop test. From this study, we could conclude that the polymer core solder ball with an additional Ni layer coating demonstrates better performance than the polymer core solder ball without Ni layer. The same observation applies to the solder ball shear strength, drop reliability performance in multiple reflow and HTS stress tests. The IMC thickness for polymer core solder ball without additional Ni layer is much thicker than the polymer core solder ball with an additional Ni layer, most probably because Ni could limit the Cu diffusion into the solder, thus resulting in better reliability performance. � 2012 Elsevier Ltd. All rights reserved.en_US
dc.description.natureFinalen_US
dc.identifier.doi10.1016/j.microrel.2012.07.032
dc.identifier.epage173
dc.identifier.issue1
dc.identifier.scopus2-s2.0-84872112183
dc.identifier.spage164
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-84872112183&doi=10.1016%2fj.microrel.2012.07.032&partnerID=40&md5=011d3caa4f307be0f3725d0122a6526c
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/29458
dc.identifier.volume53
dc.pagecount9
dc.sourceScopus
dc.sourcetitleMicroelectronics Reliability
dc.subjectCopper
dc.subjectDiffusion
dc.subjectDrops
dc.subjectElectronics packaging
dc.subjectIntermetallics
dc.subjectNickel
dc.subjectPolymers
dc.subjectReliability
dc.subjectTesting
dc.subjectAnalytical software
dc.subjectBall grid array packages
dc.subjectComparison study
dc.subjectCu diffusion
dc.subjectDiffusion rate
dc.subjectDrop test
dc.subjectDrop test reliability
dc.subjectDrop-balls
dc.subjectHigh temperature stress
dc.subjectIMC thickness
dc.subjectKirkendall void
dc.subjectLead-free products
dc.subjectReliability performance
dc.subjectReliability test
dc.subjectSolder ball shear
dc.subjectSolder balls
dc.subjectSolder joints
dc.subjectStress test
dc.subjectWork study
dc.subjectSoldering
dc.titleComparison study on reliability performance for polymer core solder balls under multiple reflow and HTS stress testsen_US
dc.typeArticleen_US
dspace.entity.typePublication
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