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Experimental and Computational Study of Mechanical and Thermal Characteristics of h-BN and GNP Infused Polymer Composites for Elevated Temperature Applications

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dc.citedby2
dc.contributor.authorChoukimath M.C.en_US
dc.contributor.authorBanapurmath N.R.en_US
dc.contributor.authorRiaz F.en_US
dc.contributor.authorPatil A.Y.en_US
dc.contributor.authorJalawadi A.R.en_US
dc.contributor.authorMujtaba M.A.en_US
dc.contributor.authorShahapurkar K.en_US
dc.contributor.authorKhan T.M.Y.en_US
dc.contributor.authorAlsehli M.en_US
dc.contributor.authorSoudagar M.E.M.en_US
dc.contributor.authorFattah I.M.R.en_US
dc.contributor.authorid57218244473en_US
dc.contributor.authorid23466196400en_US
dc.contributor.authorid56610065900en_US
dc.contributor.authorid57201735277en_US
dc.contributor.authorid57218253081en_US
dc.contributor.authorid57211606224en_US
dc.contributor.authorid57196344622en_US
dc.contributor.authorid57455192700en_US
dc.contributor.authorid57194411794en_US
dc.contributor.authorid57194384501en_US
dc.contributor.authorid57929684200en_US
dc.date.accessioned2023-05-29T09:36:48Z
dc.date.available2023-05-29T09:36:48Z
dc.date.issued2022
dc.descriptionBending strength; Boron nitride; Composite materials; Graphene; III-V semiconductors; Loads (forces); Nanocomposites; Reinforcement; Scanning electron microscopy; Thermogravimetric analysis; Computational studies; Epoxy; Graphene nanoplatelets; H-boron nitrides; High-temperature application; Load-bearing capacity; Mechanical characteristics; Polymer composite; Polymer materials; Polymer-based nanocomposites; High temperature applicationsen_US
dc.description.abstractPolymer-based nanocomposites are being considered as replacements for conventional materials in medium to high-temperature applications. This article aims to discover the synergistic effects of reinforcements on the developed polymer-based nanocomposite. An epoxy-based polymer composite was manufactured by reinforcing graphene nanoplatelets (GNP) and h-boron nitride (h-BN) nanofillers. The composites were prepared by varying the reinforcements with the step of 0.1 from 0.1 to 0.6%. Ultrasonication was carried out to ensure the homogenous dispersion of reinforcements. Mechanical, thermal, functional, and scanning electron microscopy (SEM) analysis was carried out on the novel manufactured composites. The evaluation revealed that the polymer composite with GNP 0.2 by wt % has shown an increase in load-bearing capacity by 265% and flexural strength by 165% compared with the pristine form, and the polymer composite with GNP and h-BN 0.6 by wt % showed an increase in load-bearing capacity by 219% and flexural strength by 114% when compared with the pristine form. Furthermore, the evaluation showed that the novel prepared nanocomposite reinforced with GNP and h-BN withstands a higher temperature, around 340 �C, which is validated by thermogravimetric analysis (TGA) trials. The numerical simulation model is implemented to gather the synthesised nanocomposite�s best composition and mechanical properties. The minor error between the simulation and experimental data endorses the model�s validity. To demonstrate the industrial applicability of the presented material, a case study is proposed to predict the temperature range for compressor blades of gas turbine engines containing nanocomposite material as the substrate and graphene/h-BN as reinforcement particles. � 2022 by the authors.en_US
dc.description.natureFinalen_US
dc.identifier.ArtNo5397
dc.identifier.doi10.3390/ma15155397
dc.identifier.issue15
dc.identifier.scopus2-s2.0-85137147659
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-85137147659&doi=10.3390%2fma15155397&partnerID=40&md5=8aabc403e37418f4fa5384a57532f9d3
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/26799
dc.identifier.volume15
dc.publisherMDPIen_US
dc.relation.ispartofAll Open Access, Gold, Green
dc.sourceScopus
dc.sourcetitleMaterials
dc.titleExperimental and Computational Study of Mechanical and Thermal Characteristics of h-BN and GNP Infused Polymer Composites for Elevated Temperature Applicationsen_US
dc.typeArticleen_US
dspace.entity.typePublication
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