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Effect of contact angle on meniscus evolution and contact line jump of underfill fluid flow in flip-chip encapsulation

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dc.citedby5
dc.contributor.authorNg F.C.en_US
dc.contributor.authorTung L.H.en_US
dc.contributor.authorZawawi M.H.en_US
dc.contributor.authorMukhtar M.A.F.M.en_US
dc.contributor.authorAbas M.A.en_US
dc.contributor.authorAbdullah M.Z.en_US
dc.contributor.authorid57192101900en_US
dc.contributor.authorid57210387852en_US
dc.contributor.authorid39162217600en_US
dc.contributor.authorid57202800854en_US
dc.contributor.authorid56893346700en_US
dc.contributor.authorid31567537400en_US
dc.date.accessioned2023-05-29T08:12:43Z
dc.date.available2023-05-29T08:12:43Z
dc.date.issued2020
dc.description.abstractDespite the contact angle of underfill fluid is largely correlated to the flowability, it was scarcely being investigated in the design optimization of flip-chip underfill encapsulation process. Furthermore, the detailed implication of the variation of contact angle on the flow mechanism was never being discussed. Thus, this paper is devoted to study the variation effect of contact angle on both spatial aspects of meniscus evolution and contact line jump of underfill flow menisci. The governing analytical equations that describe both meniscus evolution and contact line jump were well-validated with the past experimental and numerical findings. It was revealed that the bump contact angle critically determined the separation between concave and convex menisci. Generally, larger bump contact angle yields the earlier formation of convex menisci that is nearer to the bump entrant. Consequently, the occurrence of convex menisci in the bump region increased for the case of high bump contact angle. Moreover, when the contact angle increases, the equilibrium positions of entrant jump meniscus locates nearer to the bump entrant; while the equilibrium meniscus of exit jump becomes further away from the bump exit. These findings provided microscopic insights of the influence of contact angle on the characteristic and dynamic of flow menisci upon interacting with the solder bump array, which may benefit both electronic packaging and microfluidics sectors in general. � 2020 PENERBIT AKADEMIA BARU-All rights reserved.en_US
dc.description.natureFinalen_US
dc.identifier.doi10.37934/cfdl.12.6.2838
dc.identifier.epage38
dc.identifier.issue6
dc.identifier.scopus2-s2.0-85090218199
dc.identifier.spage28
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-85090218199&doi=10.37934%2fcfdl.12.6.2838&partnerID=40&md5=ff92c146b2a8bdbceb95e3d430de23c9
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/25684
dc.identifier.volume12
dc.publisherPenerbit Akademia Baruen_US
dc.relation.ispartofAll Open Access, Bronze
dc.sourceScopus
dc.sourcetitleCFD Letters
dc.titleEffect of contact angle on meniscus evolution and contact line jump of underfill fluid flow in flip-chip encapsulationen_US
dc.typeArticleen_US
dspace.entity.typePublication
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