Publication:
A review of thermal interface material fabrication method toward enhancing heat dissipation

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dc.citedby26
dc.contributor.authorBahru R.en_US
dc.contributor.authorZamri M.F.M.A.en_US
dc.contributor.authorShamsuddin A.H.en_US
dc.contributor.authorShaari N.en_US
dc.contributor.authorMohamed M.A.en_US
dc.contributor.authorid57195836029en_US
dc.contributor.authorid57354218900en_US
dc.contributor.authorid35779071900en_US
dc.contributor.authorid57190803462en_US
dc.contributor.authorid57581478900en_US
dc.date.accessioned2023-05-29T09:08:47Z
dc.date.available2023-05-29T09:08:47Z
dc.date.issued2021
dc.descriptionElectronic equipment; Fabrication; Hybrid materials; Interfaces (materials); Nanostructured materials; Thermal insulating materials; Electronic device; Fabrication method; Industrial markets; Material fabrication; Performance of devices; Surface temperatures; Thermal interface materials; Thermal Performance; Thermal conductivityen_US
dc.description.abstractThermal interface materials (TIMs) are applied in electronic devices that are involved in heat generation and raising the temperature. The optimization of TIMs is important in heat dissipation to maintain the good performance of devices, low power during operation, and reduced internal damages among small components. The TIMs are inserted between two contact surfaces to enhance thermal conductivity that will reduce the increment of surface temperature in a longer time and facilitates the cooling process with a consistent power supplied to the system with minimum increment. Research on nanomaterials and hybrid materials aims to obtain maximum thermal conductivity and reduce resistance in the devices. However, the suitable fabrication method for achieving good production and performance is still debatable. Therefore, significant fabrication methods have been explored for various materials. This review provides insights into the current work focusing on the materials used in the development of TIMs by various methods. The discussion begins with the introduction of thermal management and the working principles applied in the system. Then, the methods applied for material fabrication into TIMs, including the advantages and disadvantages of the methods, are discussed. Last, the current challenges and opportunities in methods used are discussed to offer new inputs and improvement in method modification for TIMs design. The targeted thermal performance for the industrial market of TIMs for nanomaterial applications is approximately 100 W/mK and 1 � 10?6 m2/WK with lowest power of 100 W. � 2020 John Wiley & Sons Ltden_US
dc.description.natureFinalen_US
dc.identifier.doi10.1002/er.6078
dc.identifier.epage3568
dc.identifier.issue3
dc.identifier.scopus2-s2.0-85092784457
dc.identifier.spage3548
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-85092784457&doi=10.1002%2fer.6078&partnerID=40&md5=af7a18e6f1d287956d0fe6fd554cd188
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/26292
dc.identifier.volume45
dc.publisherJohn Wiley and Sons Ltden_US
dc.relation.ispartofAll Open Access, Bronze
dc.sourceScopus
dc.sourcetitleInternational Journal of Energy Research
dc.titleA review of thermal interface material fabrication method toward enhancing heat dissipationen_US
dc.typeReviewen_US
dspace.entity.typePublication
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