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Nanoindentation characterization of Sn-Ag-Sb/Cu substrate IMC Layer subject to thermal aging

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dc.citedby2
dc.contributor.authorShualdi W.en_US
dc.contributor.authorBais B.en_US
dc.contributor.authorAhmad I.en_US
dc.contributor.authorOmar G.en_US
dc.contributor.authorIsnin A.en_US
dc.contributor.authorid36194999100en_US
dc.contributor.authorid9638472600en_US
dc.contributor.authorid12792216600en_US
dc.contributor.authorid11540084800en_US
dc.contributor.authorid24338529400en_US
dc.date.accessioned2023-12-28T07:05:46Z
dc.date.available2023-12-28T07:05:46Z
dc.date.issued2011
dc.description.abstractIntermetallic compound (IMC) plays great roles in connecting components to PCB boards, as well as die attach materials connecting chips to substrates. Cracks in IMC may leads to failure in an electronic product function. Therefore it is important to investigate the mechanical properties of the IMC to ensure the reliability of the solder joints. In this paper, a nanoindentation test was performed at IMCs that grow on the interface between Sn-Ag-Sb lead-free solder alloy and its Cu substrate. The test was done from planar IMC surface. Prior of that, the specimens were subjected to thermal aging process until 1500 hours at 175�C to accelerate the growth of IMC. The nanotest was executed on specimens with completed aging time for 100, 200, 400, 800 and 1500 hours. Nanoindentation results in this paper show the hardness and Young modulus of IMC composition as a whole, without interpretation of hardness properties of Cu3Sn and Cu6Sn5 individually. The hardness of Sn-Ag-Sb/Cu Substrate IMC Layer is decreasing from 5.583 GPa to4.444 GPa while the Young modulus is decreasing from 106.475 GPa to 128.439 GPa. � 2011 IEEE.en_US
dc.description.natureFinalen_US
dc.identifier.ArtNo6088328
dc.identifier.doi10.1109/RSM.2011.6088328
dc.identifier.epage223
dc.identifier.scopus2-s2.0-83755196515
dc.identifier.spage220
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-83755196515&doi=10.1109%2fRSM.2011.6088328&partnerID=40&md5=7ab5243a8ee14c2b1007c5ac1a2d232e
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/29601
dc.pagecount3
dc.sourceScopus
dc.sourcetitle2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts
dc.subjectIntermetallic compound
dc.subjectnanoindentation
dc.subjectSnAgSb lead free
dc.subjectYoung modulus
dc.subjectCopper alloys
dc.subjectHardness
dc.subjectInterfaces (materials)
dc.subjectIntermetallics
dc.subjectNanoindentation
dc.subjectSilver
dc.subjectSilver alloys
dc.subjectSoldering alloys
dc.subjectSubstrates
dc.subjectThermal aging
dc.subjectAging time
dc.subjectCu substrate
dc.subjectDie-attach materials
dc.subjectElectronic product
dc.subjectIMC layer
dc.subjectLead-free solder alloy
dc.subjectNanoindentation tests
dc.subjectSnAgSb lead free
dc.subjectSolder joints
dc.subjectYoung modulus
dc.subjectTin
dc.titleNanoindentation characterization of Sn-Ag-Sb/Cu substrate IMC Layer subject to thermal agingen_US
dc.typeConference paperen_US
dspace.entity.typePublication
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