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Micromechanical and microstructure evolution of leaded (SnPb) and lead-free (SAC305 and SnCu) mixed solder joints during isothermal aging

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dc.citedby1
dc.contributor.authorZulkifli M.N.en_US
dc.contributor.authorAbdullah I.en_US
dc.contributor.authorAzhan N.H.en_US
dc.contributor.authorJalar A.en_US
dc.contributor.authorid36703431600en_US
dc.contributor.authorid57224607172en_US
dc.contributor.authorid56652239100en_US
dc.contributor.authorid11539926200en_US
dc.date.accessioned2025-03-03T07:47:33Z
dc.date.available2025-03-03T07:47:33Z
dc.date.issued2024
dc.description.abstractThis paper studies how isothermal aging affects the micromechanical and structural properties of mixed solder joints made of 60Sn-40Pb (SnPb) with Sn-3.0Ag-0.5Cu (SAC305) and SnPb with Sn-0.7Cu (SnCu). The nanoindentation test was done to measure the micromechanical properties of SnPb/SAC305 and SnPb/SnCu mixed solder joints. These properties are hardness, reduced modulus, and stress exponent. Scanning electron microscopy (SEM) was used to look at the microstructure of a cross-section of mixed solder joints. The micrographs that were taken were then examined with open-source image processing software called ImageJ. It was found that the rate and distribution of intermetallic compound (IMC) formation and the reduction of Sn-rich phase grain size affect how the hardness and stress exponent values of mixed solder joints change after 1000 h of high temperature storage (HTS). ImageJ analysis shows that the Pb-rich phase particle count and distribution can be used to figure out how mixed solder joints respond to indentation creep and how that relates to isothermal aging. Using ImageJ, it?s clear that the indentation creep behavior of the GBS mechanism of an as soldered SnPb/SnCu mixed solder joint is caused by the highest number and size of Pb-rich phase particles that are not well distributed across the dendritic area of Sn-rich phase grain boundaries. ? 2024 Informa UK Limited, trading as Taylor & Francis Group.en_US
dc.description.natureFinalen_US
dc.identifier.doi10.1080/01694243.2024.2356962
dc.identifier.epage3859
dc.identifier.issue20
dc.identifier.scopus2-s2.0-85193970262
dc.identifier.spage3842
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-85193970262&doi=10.1080%2f01694243.2024.2356962&partnerID=40&md5=8024b795cb3c3419cc5b1139d9d501a4
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/37106
dc.identifier.volume38
dc.pagecount17
dc.publisherTaylor and Francis Ltd.en_US
dc.sourceScopus
dc.sourcetitleJournal of Adhesion Science and Technology
dc.subjectBinary alloys
dc.subjectCopper alloys
dc.subjectCreep
dc.subjectGrain boundaries
dc.subjectHardness
dc.subjectIsotherms
dc.subjectLead alloys
dc.subjectLead-free solders
dc.subjectMicrostructure
dc.subjectOpen source software
dc.subjectParticle size analysis
dc.subjectScanning electron microscopy
dc.subjectSilver alloys
dc.subjectTernary alloys
dc.subjectTin alloys
dc.subjectImagej
dc.subjectIsothermal ageing
dc.subjectMicro-mechanical
dc.subjectMixed solder joint
dc.subjectNano indentation
dc.subjectPhase grains
dc.subjectPhase particles
dc.subjectRich phase
dc.subjectSolder joints
dc.subjectStress exponents
dc.subjectNanoindentation
dc.titleMicromechanical and microstructure evolution of leaded (SnPb) and lead-free (SAC305 and SnCu) mixed solder joints during isothermal agingen_US
dc.typeArticleen_US
dspace.entity.typePublication
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