Publication:
Process optimization approach in fine pitch Cu wire bonding

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dc.citedby10
dc.contributor.authorWong B.K.en_US
dc.contributor.authorYong C.C.en_US
dc.contributor.authorEu P.L.en_US
dc.contributor.authorYap B.K.en_US
dc.contributor.authorid36992192300en_US
dc.contributor.authorid24726352800en_US
dc.contributor.authorid55911544700en_US
dc.contributor.authorid26649255900en_US
dc.date.accessioned2023-12-29T07:48:17Z
dc.date.available2023-12-29T07:48:17Z
dc.date.issued2011
dc.description.abstractWith SiO2 dielectric under aluminum pads, a 60 m bond pad pitch with 52 um bond pad opening Cu wire bonding process was developed in PBGA Hip 7 PGE wafer technology. The critical factors (wire type, capillary, and bonding parameter) and critical responses (bonded ball diameter, bonded ball height, wire pull, ball shear and number of metal lift/peeling and ball lift after wire pull) are affecting bonding quality. Design of experiment and response of surface were used to optimize the bonding parameters. The wire pull and ball shear test at three thermal aging read points were studied. � 2011 IEEE.en_US
dc.description.natureFinalen_US
dc.identifier.ArtNo5959077
dc.identifier.doi10.1109/ICEDSA.2011.5959077
dc.identifier.epage151
dc.identifier.scopus2-s2.0-80055092447
dc.identifier.spage147
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-80055092447&doi=10.1109%2fICEDSA.2011.5959077&partnerID=40&md5=b5475216c175b77de9b5449fc14838a6
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/30475
dc.pagecount4
dc.sourceScopus
dc.sourcetitleInternational Conference on Electronic Devices, Systems, and Applications
dc.subjectDesign of experiments
dc.subjectDielectric materials
dc.subjectOptimization
dc.subjectSilicon compounds
dc.subjectSpheres
dc.subjectThermal aging
dc.subjectThermoelectric equipment
dc.subjectWafer bonding
dc.subjectAluminum pad
dc.subjectBall diameter
dc.subjectBall shear
dc.subjectBall-shear test
dc.subjectBond pad
dc.subjectBonding parameters
dc.subjectBonding quality
dc.subjectCritical factors
dc.subjectCritical response
dc.subjectFine pitch
dc.subjectWafer technology
dc.subjectWire bonding
dc.subjectWire
dc.titleProcess optimization approach in fine pitch Cu wire bondingen_US
dc.typeConference paperen_US
dspace.entity.typePublication
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