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Experimental and smoothed particle hydrodynamics analysis of interfacial bonding between aluminum powder particles and aluminum substrate by cold spray technique

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dc.citedby13
dc.contributor.authorManap A.en_US
dc.contributor.authorOkabe T.en_US
dc.contributor.authorOgawa K.en_US
dc.contributor.authorMahalingam S.en_US
dc.contributor.authorAbdullah H.en_US
dc.contributor.authorid57200642155en_US
dc.contributor.authorid7201390003en_US
dc.contributor.authorid7404212037en_US
dc.contributor.authorid55434075500en_US
dc.contributor.authorid26025061200en_US
dc.date.accessioned2023-05-29T07:24:22Z
dc.date.available2023-05-29T07:24:22Z
dc.date.issued2019
dc.descriptionAdhesives; Aluminum; Aluminum coatings; Aluminum powder metallurgy; Bonding; Deposition; High resolution transmission electron microscopy; Ion beams; Models; Morphology; Numerical methods; Scanning electron microscopy; Velocity; Velocity control; Cold spray; Cold spray techniques; Impact behavior; Interface morphologies; Interfacial bonding; Particle deformation; Smoothed particle hydrodynamics; Smoothed particle hydrodynamics methods; Hydrodynamicsen_US
dc.description.abstractThis study aims on the dominant bonding mechanism between aluminum powder particles and aluminum substrate evaluated both experimentally and numerically. Aluminum particles were deposited at different velocities onto an aluminum substrate by cold spray (CS) technology. The crater, bond, and interface morphology upon impact were characterized using scanning electron microscopy, focused ion beam processing, and transmission electron microscopy. Experimental results reveal that rebound phenomenon existed at high velocities and excellent contact is obtained above the critical velocity. This denotes that ideal deposition occurs at a certain particle velocity scale. Meanwhile, the numerical analysis was performed via smoothed particle hydrodynamics (SPH) method. The simulated particle deformation behavior agreed well with the experimentally evaluated impact morphology, which confirms the viability of the SPH procedure for CS simulation. Furthermore, the numerically calculated deposition range was in correspondence with the experimental findings. The analysis demonstrates that interfacial bonding between the powder particles and substrate is influenced by the adhesive intersurface forces of the contacting surfaces. � 2019, Springer-Verlag London Ltd., part of Springer Nature.en_US
dc.description.natureFinalen_US
dc.identifier.doi10.1007/s00170-019-03846-4
dc.identifier.epage4527
dc.identifier.issue9-Dec
dc.identifier.scopus2-s2.0-85069989556
dc.identifier.spage4519
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-85069989556&doi=10.1007%2fs00170-019-03846-4&partnerID=40&md5=32133721648e930840e0fbf5fe70db23
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/24541
dc.identifier.volume103
dc.publisherSpringer Londonen_US
dc.sourceScopus
dc.sourcetitleInternational Journal of Advanced Manufacturing Technology
dc.titleExperimental and smoothed particle hydrodynamics analysis of interfacial bonding between aluminum powder particles and aluminum substrate by cold spray techniqueen_US
dc.typeArticleen_US
dspace.entity.typePublication
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