Publication:
Numerical Analysis on Heat Sinks with Different Geometries for PC Cooling System

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dc.citedby0
dc.contributor.authorSukri M.S.en_US
dc.contributor.authorWanatasanappan V.V.en_US
dc.contributor.authorid59012656400en_US
dc.contributor.authorid57217224948en_US
dc.date.accessioned2025-03-03T07:43:11Z
dc.date.available2025-03-03T07:43:11Z
dc.date.issued2024
dc.description.abstractA heat sink is a device that removes heat from electronic devices that consume electricity. This heat removal is required to meet the equipment's design requirements. In this paper, different heat sink geometries are designed and simulated using computational fluids dynamic software to compare the temperature distribution and thermal performance. The main objective is to investigate the effect of the fin arrangement, base plate thickness and type of heat sink material on the thermal performance of heat sinks using the Ansys FLUENT 2021. The heat sinks have been analyzed at different heat load supply of 60 W, 70 W and 80 W. Three different fins arrangement of rectangular plates, rectangular pins and separated short plates heat sink are compared of the thermal performance in this study. The effects of heat sink materials on thermal performance were also investigated numerically. In this research work, thermal resistance is the parameter that determines the thermal performance of the heat sinks. The findings revealed that the thermal resistance is lower for the copper rectangular plates heat sink with 5 mm base plate thickness. ? 2024 American Institute of Physics Inc.. All rights reserved.en_US
dc.description.natureFinalen_US
dc.identifier.ArtNo20023
dc.identifier.doi10.1063/5.0181996
dc.identifier.issue1
dc.identifier.scopus2-s2.0-85192012842
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-85192012842&doi=10.1063%2f5.0181996&partnerID=40&md5=e82165616ce77fc8f4c3cb802820e863
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/36579
dc.identifier.volume2799
dc.publisherAmerican Institute of Physicsen_US
dc.sourceScopus
dc.sourcetitleAIP Conference Proceedings
dc.titleNumerical Analysis on Heat Sinks with Different Geometries for PC Cooling Systemen_US
dc.typeConference paperen_US
dspace.entity.typePublication
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