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Multi beam laser grooving process parameter development and die strength characterization for 40nm node low-K/ULK wafer

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dc.citedby1
dc.contributor.authorShi K.W.en_US
dc.contributor.authorYow K.Y.en_US
dc.contributor.authorLo C.en_US
dc.contributor.authorKar Y.B.en_US
dc.contributor.authorMisran H.en_US
dc.contributor.authorid35796107300en_US
dc.contributor.authorid36005003700en_US
dc.contributor.authorid55340865500en_US
dc.contributor.authorid26649255900en_US
dc.contributor.authorid6506899840en_US
dc.date.accessioned2023-05-29T06:00:13Z
dc.date.available2023-05-29T06:00:13Z
dc.date.issued2015
dc.descriptionAblation; Cost effectiveness; Dies; Industrial electronics; Ion beams; Laser ablation; Neodymium alloys; Neodymium lasers; Scanning electron microscopy; Semiconductor lasers; Silicon wafers; Yttrium aluminum garnet; Inspection tools; Laser frequency; Laser micro-machining; Laser process parameters; Mass production; Package reliability; Process parameters; Throughput improvement; Laser beam effectsen_US
dc.description.abstractThis paper describes the development work of enabling a multi beam laser grooving technology for 40nm node low-k/ULK semiconductor device. A Nd:YAG ultraviolet (UV) laser diode operating at a wavelength of 355 nm was used in the study. The effects of multi beam laser micromachining parameters, i.e. laser power, laser frequency, feed speed, and defocus amount were investigated. The laser processed die samples were thoroughly inspected and characterized, which included the die edge and die sidewall grooving quality, the grooving shape/profile and the laser grooving depth examination. Die strength is important and critical. Die damage from thermal and ablation caused by the laser around the die peripheral weakens the mechanical strength within the die, causing a reduction in die strength. The strength of a laser grooved die was improved by optimizing the laser process parameter. High power optical microscopy, scanning electron microscopy (SEM), and focused ion beam (FIB) are the inspection tools/methods used in this study. Package reliability and stressing were carried out to confirm the robustness of the multi beam laser grooving process parameter and condition in a mass production environment. The dicing defects caused by the laser were validated by using failure analysis. The advantages and limitations of conventional single beam compared to multi beam laser grooving process were also discussed. It is shown that, multi beam laser grooving is possibly one of the best solutions to choose for dicing quality and throughput improvements for low-k/ULK wafer dicing. The multi beam laser process is a feasible, efficient, and cost effective process compared to the conventional single beam laser ablation process. � 2014 IEEE.en_US
dc.description.natureFinalen_US
dc.identifier.ArtNo7123083
dc.identifier.doi10.1109/IEMT.2014.7123083
dc.identifier.scopus2-s2.0-84944339117
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-84944339117&doi=10.1109%2fIEMT.2014.7123083&partnerID=40&md5=a657e62e4b8bbd859d0f90e747fadb92
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/22324
dc.identifier.volume2015-June
dc.publisherInstitute of Electrical and Electronics Engineers Inc.en_US
dc.sourceScopus
dc.sourcetitleProceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium
dc.titleMulti beam laser grooving process parameter development and die strength characterization for 40nm node low-K/ULK waferen_US
dc.typeConference Paperen_US
dspace.entity.typePublication
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