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Characterisation of insulated Cu wire ball bonding

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dc.contributor.authorLeong H.Y.en_US
dc.contributor.authorYap B.K.en_US
dc.contributor.authorKhan N.en_US
dc.contributor.authorIbrahim M.R.en_US
dc.contributor.authorTan L.C.en_US
dc.contributor.authorFaiz M.en_US
dc.contributor.authorid55787052600en_US
dc.contributor.authorid26649255900en_US
dc.contributor.authorid9736201900en_US
dc.contributor.authorid16021986000en_US
dc.contributor.authorid57661553500en_US
dc.contributor.authorid56450441300en_US
dc.date.accessioned2023-05-16T02:45:33Z
dc.date.available2023-05-16T02:45:33Z
dc.date.issued2014
dc.description.abstractInsulated Cu wire technology offers potential solutions for fine and ultra-fine pitch wire bonding as the insulator coating on the bare wire prevents wires shorting problem. Most previous works focused on insulated wire stitch bonding. This paper presents a comparison study between insulated Cu and bare Cu wire ball-bonding process characterisation in the standpoints of free air ball formation, Al splash, hardness, ball bond strength and intermetallic growth at the bond interface study. Spherical and clean free air ball was formed using lower electric flame off energy compared to bare Cu wire. The study shows that insulated Cu bonding demonstrated comparable equivalent ball bond strength to bare Cu wire bonding at T0 and even after subjected to isothermal aging 175°C up to 1008 hours. Intermetallic formation was uniform at the bond interface for both wires. Insulated Cu wire demonstrates good bondability and reliability performance, suitable for fine pitch wire bonding in large-scale integration applications. © 2014 W. S. Maney & Son Ltd.en_US
dc.description.natureFinalen_US
dc.identifier.doi10.1179/1432891714Z.0000000001019
dc.identifier.epage269-S6-273
dc.identifier.scopus2-s2.0-84918795833
dc.identifier.spageS6
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-84918795833&doi=10.1179%2f1432891714Z.0000000001019&partnerID=40&md5=4e54ecd8297e28ddef9ce8231ed2e79c
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/21820
dc.identifier.volume18
dc.publisherManey Publishingen_US
dc.sourceScopus
dc.sourcetitleMaterials Research Innovations
dc.titleCharacterisation of insulated Cu wire ball bondingen_US
dc.typeArticleen_US
dspace.entity.typePublication
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