Publication:
The effects of solution baths to the microstructure and thickness of ni-ti plating by high speed plating

Simple item page
dc.contributor.authorZaimah N.en_US
dc.contributor.authorHussain M.S.en_US
dc.contributor.authorid57210910803en_US
dc.contributor.authorid36930267600en_US
dc.date.accessioned2023-05-16T02:46:14Z
dc.date.available2023-05-16T02:46:14Z
dc.date.issued2014
dc.description.abstractIt is difficult to obtain good adhesive property on the titanium surface. Thus, to plate metal on the titanium, oxide layer must be eliminated by using an intermediate pre-treatment. However, this process involves several steps and even then the level of addition between the plated metal and the titanium is poor. This paper presents the results of the thickness and morphology of nickel plating to titanium sample with the effects of the types of solutions. The morphology and thickness of nickel plated was studied using scanning electron microscopy (SEM) and field emission scanning electron microscopy (FESEM). The results show nickel sulphamate solution gave highest rate of plating compared to the other solutions while all chloride solution produces much fine grain structure. By using high speed electroplating and by maintaining a narrow gap between the anode and the cathode, it has been possible to electrodeposit Ni directly on Ti without any pre-treatment or even any conventional cleaning process before plating. © (2014) Trans Tech Publications, Switzerland.en_US
dc.description.natureFinalen_US
dc.identifier.doi10.4028/www.scientific.net/AMR.845.251
dc.identifier.epage255
dc.identifier.scopus2-s2.0-84891506191
dc.identifier.spage251
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-84891506191&doi=10.4028%2fwww.scientific.net%2fAMR.845.251&partnerID=40&md5=a1e17cd0dc7c594bb3fd00eb8355e373
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/21947
dc.identifier.volume845
dc.sourceScopus
dc.sourcetitleAdvanced Materials Research
dc.titleThe effects of solution baths to the microstructure and thickness of ni-ti plating by high speed platingen_US
dc.typeConference Paperen_US
dspace.entity.typePublication
Files
Collections
SCOPUS