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A study of defects generation on Ni�Co substrate during electroplating and its minimisation through proper cleaning

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dc.citedby1
dc.contributor.authorBegum S.en_US
dc.contributor.authorSambasivam K.en_US
dc.contributor.authorAnsari M.N.M.en_US
dc.contributor.authorHashmi M.S.J.en_US
dc.contributor.authorid57216608034en_US
dc.contributor.authorid55488875000en_US
dc.contributor.authorid55489853600en_US
dc.contributor.authorid36501681300en_US
dc.date.accessioned2023-05-29T08:08:53Z
dc.date.available2023-05-29T08:08:53Z
dc.date.issued2020
dc.description.abstractThere are numerous substrates that are electroplated in electronic industry to use in electronic devices. Nickel�Cobalt (Ni�Co) is one of the substrates that is used in the integrated circuits for telecommunication. The substrate is needed to prepare before electroplating of which pre-cleaning is of paramount importance. The substrate must be cleaned to remove grease, oil, etc. from the surface. Moreover, the gold contaminant on the surface of Ni�Co substrate is transformed to gold oxide during heat treatment, which is a prerequisite step before electroplating. It was observed that standard pre-cleaning procedure practiced in the electronic industry cannot remove the oxide contaminant. Fairly controlled uniform thickness can be achieved by proper control of electroplating parameters. However, the defects generated on plated substrate cannot be eliminated by controlling electroplating parameters. It was found that pre-cleaning of substrate played an important role to eliminate the contaminants. Poor adhesion of plating materials, blistering, skip plating, plate flakes, pitting are a few common plating defects which result in poor solderability. In this review, electroplating and its defects and minimisation of defects are discussed. Surface preparation before plating is crucial in this respect. Defect-free substrate results in efficient solderability, consequently reducing rejection rate of substrate and increasing the yield, thereby, making the process cost effective. � 2020, � 2020 Informa UK Limited, trading as Taylor & Francis Group.en_US
dc.description.natureFinalen_US
dc.identifier.doi10.1080/2374068X.2020.1728646
dc.identifier.epage590
dc.identifier.issue3
dc.identifier.scopus2-s2.0-85081213176
dc.identifier.spage565
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-85081213176&doi=10.1080%2f2374068X.2020.1728646&partnerID=40&md5=994d9048c7c42dd10ff181142b9d8f01
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/25393
dc.identifier.volume6
dc.publisherTaylor and Francis Ltd.en_US
dc.sourceScopus
dc.sourcetitleAdvances in Materials and Processing Technologies
dc.titleA study of defects generation on Ni�Co substrate during electroplating and its minimisation through proper cleaningen_US
dc.typeReviewen_US
dspace.entity.typePublication
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