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The effects of solution movement to the microstructure and size of nickel plating on titanium surface by high speed direct nano-crystalline plating

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dc.contributor.authorZaimah N.en_US
dc.contributor.authorHussain M.S.en_US
dc.contributor.authorMasrur L.en_US
dc.contributor.authorid57210910803en_US
dc.contributor.authorid36930267600en_US
dc.contributor.authorid55994884500en_US
dc.date.accessioned2023-05-16T02:46:12Z
dc.date.available2023-05-16T02:46:12Z
dc.date.issued2014
dc.description.abstractTitanium has been widely used in many field of application due to the low density, sensitive to corrosion, high mechanical strength and ease of fabrication. It also has been widely used as structural materials in variety of industrial fields such as aeronautical, energy and chemical industry. Plating of metal on titanium is complex and difficult because titanium always reacts with air to form oxide. It is difficult to obtain good adhesive property on the titanium surface. Thus, to plate metal on the titanium, oxide layer must be eliminated by using an intermediate pre-treatment. However, this process involves several steps and even then the level of addition between the plated metal and the titanium is poor. This paper presents the results of the thickness and morphology of plated sample with the effects of the rate of deposition. The level adhesion of the nickel coating was determined qualitatively by using adhesion testing while morphology and thickness of Ni plated was studied using scanning electron microscopy (SEM) and field emissionscanning electron microscopy (FESEM). The results show by increasing the solution movement, it has been possible to obtain higher rate of plating and Ni deposits with higher hardness and finer grain structures. By using high speed electroplating and by maintaining a narrow gap between the anode and the cathode, it has been possible to electrodeposit Ni directly on Ti without any pre-treatment or even without any traditional cleaning before plating. © (2014) Trans Tech Publications, Switzerland.en_US
dc.description.natureFinalen_US
dc.identifier.doi10.4028/www.scientific.net/AMM.465-466.867
dc.identifier.epage871
dc.identifier.scopus2-s2.0-84891917803
dc.identifier.spage867
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-84891917803&doi=10.4028%2fwww.scientific.net%2fAMM.465-466.867&partnerID=40&md5=ab0126a80d2618f8f40b2311b29ebf80
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/21943
dc.identifier.volume465-466
dc.sourceScopus
dc.sourcetitleApplied Mechanics and Materials
dc.titleThe effects of solution movement to the microstructure and size of nickel plating on titanium surface by high speed direct nano-crystalline platingen_US
dc.typeConference Paperen_US
dspace.entity.typePublication
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