Publication:
Stitch bond strength study in insulated Cu wire bonding

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dc.citedby2
dc.contributor.authorLeong H.Y.en_US
dc.contributor.authorYap B.K.en_US
dc.contributor.authorKhan N.en_US
dc.contributor.authorIbrahim M.R.en_US
dc.contributor.authorTan L.C.en_US
dc.contributor.authorFaiz M.en_US
dc.contributor.authorid55787052600en_US
dc.contributor.authorid26649255900en_US
dc.contributor.authorid9736201900en_US
dc.contributor.authorid16021986000en_US
dc.contributor.authorid57661553500en_US
dc.contributor.authorid56450441300en_US
dc.date.accessioned2023-05-16T02:22:46Z
dc.date.available2023-05-16T02:22:46Z
dc.date.issued2014
dc.description.abstractThe market demands for higher pin counts and more chips functionality pose challenges in conventional wire bonding. However, insulated Cu wire technology enables fine and ultra-fine pitch wire bonding as the insulator coating on the bare wire prevents wires shorting problem. This paper presents the study on the stitch-bonding process optimisation and its challenges for the insulated Cu wire with a diameter of 20 ?m. Insulated Cu stitch bond samples show 37% lower stitch pull strength than that of bare Cu. The cross-sectioned insulated Cu stitch bond shows that there is an insulation residue between the Cu stitch and the Au-plated substrate, potentially resulting in lower stitch pull performance. However, after isothermal aging at 225°C for up to 78 hours, the stitch pull results for insulated Cu wire passed the industry reliability standard, without any lifted bond. A detailed comparison study was performed for the insulated Cu and the bare Cu stitch bonding. © 2014 W. S. Maney & Son Ltd.en_US
dc.description.natureFinalen_US
dc.identifier.doi10.1179/1432891714Z.0000000001018
dc.identifier.epage264-S6-268
dc.identifier.scopus2-s2.0-84918834211
dc.identifier.spageS6
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-84918834211&doi=10.1179%2f1432891714Z.0000000001018&partnerID=40&md5=639c43c31ca85a82b6877bf6a081bd8b
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/21816
dc.identifier.volume18
dc.publisherManey Publishingen_US
dc.sourceScopus
dc.sourcetitleMaterials Research Innovations
dc.titleStitch bond strength study in insulated Cu wire bondingen_US
dc.typeArticleen_US
dspace.entity.typePublication
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