Publication:
Analysis of Transmission Performance for Fine Pitch Interconnect

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dc.citedby0
dc.contributor.authorLeong H.Y.en_US
dc.contributor.authorYap B.K.en_US
dc.contributor.authorChin L.P.en_US
dc.contributor.authorZuraida E.E.en_US
dc.contributor.authorAwang Mat Z.en_US
dc.contributor.authorid55787052600en_US
dc.contributor.authorid26649255900en_US
dc.contributor.authorid58310807100en_US
dc.contributor.authorid58311394500en_US
dc.contributor.authorid57197760538en_US
dc.date.accessioned2024-10-14T03:20:57Z
dc.date.available2024-10-14T03:20:57Z
dc.date.issued2023
dc.description.abstractWire bonding is the preferred interconnection in the IC packaging. Understanding the electrical performance of bonding wire as transmission line is utmost important. To date, there are very limited studies on the transmission performance of fine pitch bare bonding wire especially the insulated wires. This paper investigated the transmission performance of single bare bonding wires and insulated bonding wires with different wire material, wire diameter, bonding height and insulation thickness at high frequency. The simulation analysis shows that when the frequency increases above 15 Ghz, the effect of geometric parameters has no significant difference to the transmission performance. The thickness of the insulation between 0.1 ?m to 0.3 ?m demonstrated similar performance for return loss and insertion loss across all frequencies. � 2023 Trans Tech Publications Ltd, Switzerland.en_US
dc.description.natureFinalen_US
dc.identifier.doi10.4028/p-6dh4yu
dc.identifier.epage72
dc.identifier.scopus2-s2.0-85161723093
dc.identifier.spage67
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-85161723093&doi=10.4028%2fp-6dh4yu&partnerID=40&md5=eb8eb150bbc1280e1e867b5ce3429945
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/34596
dc.identifier.volume343
dc.pagecount5
dc.publisherTrans Tech Publications Ltden_US
dc.sourceScopus
dc.sourcetitleSolid State Phenomena
dc.subjectelectrical performance
dc.subjectfine pitch interconnect
dc.subjectinsulated Cu wire
dc.subjectsignal transmission
dc.titleAnalysis of Transmission Performance for Fine Pitch Interconnecten_US
dc.typeBook chapteren_US
dspace.entity.typePublication
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