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Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: Materials and technologies

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dc.citedby17
dc.contributor.authorDele-Afolabi T.T.en_US
dc.contributor.authorAnsari M.N.M.en_US
dc.contributor.authorAzmah Hanim M.A.en_US
dc.contributor.authorOyekanmi A.A.en_US
dc.contributor.authorOjo-Kupoluyi O.J.en_US
dc.contributor.authorAtiqah A.en_US
dc.contributor.authorid56225674500en_US
dc.contributor.authorid55489853600en_US
dc.contributor.authorid24723635600en_US
dc.contributor.authorid57194067040en_US
dc.contributor.authorid57193319922en_US
dc.contributor.authorid55366998300en_US
dc.date.accessioned2024-10-14T03:18:10Z
dc.date.available2024-10-14T03:18:10Z
dc.date.issued2023
dc.description.abstractThe electronic industry faces a number of issues as a result of the rapid miniaturization of electronic products and the expansion of application areas, with the reliability of electronic packaging materials playing a significant role. Moreover, the continuously harsh service conditions of electronic products like high current density and excessive Joule heat will lead to severe reliability concerns of electromigration and thermomigration, which evidently curtail the lifespan of solder joints. Therefore, to maintain the reliability of solder joints in recent microelectronic applications, several investigations have been conducted in the last decade to proffer solutions to the drawbacks affecting the full implementation of the Sn-based solders in advanced packaging technologies. This article reviews the recent developments on the reliability investigation of Sn-based solder joints and discusses the influence of interlayer materials, electroless nickel immersion silver (ENImAg) surface finish, geopolymer ceramics and rotary magnetic field (RMF) technology. The 3D network structure of porous interlayer metals and the beneficial features of ENImAg surface finish have demonstrated to be highly efficient in revamping existing lead-free solders by satisfying the needs of both high-temperature service operation and low-temperature soldering. While transient current bonding technology is efficient at preventing agglomeration and floating of nano-sized reinforcements in composite solders, RMF technology is effective in controlling the flow and solidification of liquid metal during the soldering process. Finally, emerging technologies for future research directions have been summarized to provide further theoretical basis required for the investigation of solder joint reliability of electronic devices in service. � 2023 The Authorsen_US
dc.description.natureFinalen_US
dc.identifier.doi10.1016/j.jmrt.2023.06.193
dc.identifier.epage4263
dc.identifier.scopus2-s2.0-85164242586
dc.identifier.spage4231
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-85164242586&doi=10.1016%2fj.jmrt.2023.06.193&partnerID=40&md5=ed6158b7e86de1188662355552dbb664
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/34152
dc.identifier.volume25
dc.pagecount32
dc.publisherElsevier Editora Ltdaen_US
dc.relation.ispartofAll Open Access
dc.relation.ispartofGold Open Access
dc.sourceScopus
dc.sourcetitleJournal of Materials Research and Technology
dc.subjectEnergy
dc.subjectENImAg surface finish
dc.subjectInterlayer components
dc.subjectIntermetallic compounds
dc.subjectRotary magnetic field
dc.subjectSn-based solder
dc.subjectElectronics packaging
dc.subjectFinishing
dc.subjectIntermetallics
dc.subjectLead-free solders
dc.subjectMicroelectronics
dc.subjectPackaging materials
dc.subjectReliability
dc.subjectSoldering
dc.subjectTemperature
dc.subjectElectronics products
dc.subjectEnergy
dc.subjectENImAg surface finish
dc.subjectInterlayer component
dc.subjectIntermetallics compounds
dc.subjectMagnetic-field
dc.subjectRotary magnetic field
dc.subjectSn-based solders
dc.subjectSolder joints
dc.subjectSurface finishes
dc.subjectMagnetic fields
dc.titleRecent advances in Sn-based lead-free solder interconnects for microelectronics packaging: Materials and technologiesen_US
dc.typeReviewen_US
dspace.entity.typePublication
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