Publication:
Technique to improve visibility for cycle time improvement in semiconductor manufacturing

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dc.citedby9
dc.contributor.authorRahim S.R.A.en_US
dc.contributor.authorAhmad I.en_US
dc.contributor.authorChik M.A.en_US
dc.contributor.authorid55602785200en_US
dc.contributor.authorid12792216600en_US
dc.contributor.authorid24775125500en_US
dc.date.accessioned2023-12-28T06:30:13Z
dc.date.available2023-12-28T06:30:13Z
dc.date.issued2012
dc.description.abstractCycle time for a product is one of the key performance indicators in semiconductor manufacturing. Reduction of cycle time will shorten product time to market, increase throughput, reduce operational cost and develop customer trust. Semiconductor manufacturing that process 40,000 to 50,000 work-in-progresses (WIP), usually takes 50 to 70 days, 300 to 400 equipments and 300 to 900 steps to complete. Thus, any task related to manual data collection to make indices reports or analysis usually needs high resources requirements to spend for manual work and risk for mistake. In the modern facility of semiconductor fabrication, a system like Manufacturing Execution Systems (MES) was implemented to ease the process and operation traceability. The information is well kept in the appropriate databases. Many applications then are integrated with MES database to perform indices reports. In this paper, the improve method for data collection related to cycle time improvement is introduced. In this approach, the automated systems was developed using existing Advance Productivity Family (APF) programming platform to collecting the data. The system is integrated between MES and APF to have the real time data collection and analysis. In the systems, manual data collection is replaced with respective automated data transfer from real situation in the manufacturing environment. This program then able to shows real root caused with proper relational charting to display real problem for engineering to prioritize and resolve respectively. As a result, 39% reduction of cycle time gained by implementing this technique. The system has successfully implemented and supports the cycle time reduction. � 2012 IEEE.en_US
dc.description.natureFinalen_US
dc.identifier.ArtNo6417223
dc.identifier.doi10.1109/SMElec.2012.6417223
dc.identifier.epage630
dc.identifier.scopus2-s2.0-84874173037
dc.identifier.spage627
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-84874173037&doi=10.1109%2fSMElec.2012.6417223&partnerID=40&md5=4422759caff58bf709c7d003661028c2
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/29485
dc.pagecount3
dc.sourceScopus
dc.sourcetitle2012 10th IEEE International Conference on Semiconductor Electronics, ICSE 2012 - Proceedings
dc.subjectAdvance Productivity Family (APF)
dc.subjectManufacturing Execution Systems (MES)
dc.subjectWork In progress (WIP)
dc.subjectAutomation
dc.subjectBenchmarking
dc.subjectData acquisition
dc.subjectData transfer
dc.subjectManufacture
dc.subjectProductivity
dc.subjectAdvance Productivity Family (APF)
dc.subjectAutomated data
dc.subjectAutomated systems
dc.subjectCustomer trust
dc.subjectCycle time
dc.subjectCycle time improvements
dc.subjectCycle time reduction
dc.subjectData collection
dc.subjectKey performance indicators
dc.subjectManual work
dc.subjectManufacturing environments
dc.subjectManufacturing Execution System
dc.subjectProduct time
dc.subjectReal problems
dc.subjectReal roots
dc.subjectReal situation
dc.subjectReal time data collections
dc.subjectSemi-conductor fabrication
dc.subjectSemiconductor manufacturing
dc.subjectWork in progress
dc.subjectSemiconductor device manufacture
dc.titleTechnique to improve visibility for cycle time improvement in semiconductor manufacturingen_US
dc.typeConference paperen_US
dspace.entity.typePublication
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