Publication:
Characterization of micropearl polymer core solder ball for BGA semiconductor packaging application

Simple item page
dc.contributor.authorTan Cai Huien_US
dc.date.accessioned2023-05-03T13:36:40Z
dc.date.available2023-05-03T13:36:40Z
dc.date.issued2012-06
dc.descriptionTHS TK7870.T36 2012en_US
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/19533
dc.language.isoenen_US
dc.titleCharacterization of micropearl polymer core solder ball for BGA semiconductor packaging applicationen_US
dc.typeResource Types::text::Thesisen_US
dspace.entity.typePublication
Files
Collections
College of Graduate Studies (COGS)