Publication:
Characterization of micropearl polymer core solder ball for BGA semiconductor packaging application

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Date
2012-06
Authors
Tan Cai Hui
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Publisher
Research Projects
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Abstract
Description
THS TK7870.T36 2012
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URI
https://irepository.uniten.edu.my/handle/123456789/19533
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College of Graduate Studies (COGS)