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Performance of Carbon Nanotube on Nickel-Plated Copper Substrate Using Electrophoretic Deposition Process for Electronic Cooling Application: Response Surface Method Optimization

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dc.citedby0
dc.contributor.authorBahru R.en_US
dc.contributor.authorZamri M.F.M.A.en_US
dc.contributor.authorid57195836029en_US
dc.contributor.authorid57354218900en_US
dc.date.accessioned2025-03-03T07:43:38Z
dc.date.available2025-03-03T07:43:38Z
dc.date.issued2024
dc.description.abstractThermal interface materials (TIMs) have emerged as a potential material for heat dissipation in the cooling system due to their good materials in heat transfer and help protect devices from damage. The main challenge of TIMs is the lower thermal conductivity of materials and poor surface contact, resulting in high internal thermal resistance. Therefore, carbon nanotubes (CNTs) are the best candidate due to their good thermal conductivity. However, the method for deposition of CNTs on the substrate involves high operating temperature and produces unwanted impurities. This study introduces electrophoretic deposition due to the convenient process with operation at room temperature, fast deposition time, simple equipment setup and production of fewer impurities. Pristine CNTs were deposited on the nickel-plated copper substrate using a direct current. The deposition yield can be varied by the variation of CNT-solvent concentration (< 1.0�mg CNT/ml) and applied voltage. The interaction between parameters of electrophoretic deposition (EPD) was optimized using Design of Experiment (DOE) software through the response surface method (RSM) to have maximum deposition of CNTs. Field emission scanning electron microscopy (SEM) was performed to analyze the surface morphology of the deposition and observe the maximum thickness of 56.95��m with 11.0�mg of CNTs deposited on nickel substrate when operated under 175�V applied voltage, 10�min deposition time for 0.50�mg/ml concentration. ? King Fahd University of Petroleum & Minerals 2024.en_US
dc.description.natureFinalen_US
dc.identifier.doi10.1007/s13369-024-08722-2
dc.identifier.epage8188
dc.identifier.issue6
dc.identifier.scopus2-s2.0-85185973637
dc.identifier.spage8177
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-85185973637&doi=10.1007%2fs13369-024-08722-2&partnerID=40&md5=974c48905f8b10691dcec51f59210544
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/36649
dc.identifier.volume49
dc.pagecount11
dc.publisherSpringer Natureen_US
dc.sourceScopus
dc.sourcetitleArabian Journal for Science and Engineering
dc.titlePerformance of Carbon Nanotube on Nickel-Plated Copper Substrate Using Electrophoretic Deposition Process for Electronic Cooling Application: Response Surface Method Optimizationen_US
dc.typeArticleen_US
dspace.entity.typePublication
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