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Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology

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dc.citedby0
dc.contributor.authorKar Y.B.en_US
dc.contributor.authorTalik N.A.en_US
dc.contributor.authorSauli Z.en_US
dc.contributor.authorSeng F.C.en_US
dc.contributor.authorYong T.C.en_US
dc.contributor.authorRetnasamy V.en_US
dc.contributor.authorid26649255900en_US
dc.contributor.authorid55576358000en_US
dc.contributor.authorid24554644300en_US
dc.contributor.authorid26432892000en_US
dc.contributor.authorid16029485400en_US
dc.contributor.authorid24802373600en_US
dc.date.accessioned2023-12-29T07:43:48Z
dc.date.available2023-12-29T07:43:48Z
dc.date.issued2013
dc.description.abstractPurpose - This paper aims to discuss the effects of ionic contaminations on the die surface of high lead flip chip ball grid array (FCBGA) package. Ionic contaminations from the flux residue, formed during the die attachment process, could affect the package long-term performance. Design/methodology/approach - Thus, the flux-cleaning process was implemented and the cleanliness effect was evaluated. Cleaning experiments using a new water-based solvent were carried out to investigate the flux-cleaning efficiency. The test packages were then evaluated via ion chromatography (IC). Findings - Ion chromatograms show that there are high levels of ionic elements detected prior to the cleaning process. After the cleaning process, the contamination levels reduced significantly. Originality/value - The value of the work here is testing of the new environmental friendly water-based MPC cleaning efficiency. The reduction of ionic contamination is thus reported. � Copyright - 2013 Emerald Group Publishing Limited. All rights reserved.en_US
dc.description.natureFinalen_US
dc.identifier.ArtNo17086474
dc.identifier.doi10.1108/13565361311314502
dc.identifier.epage103
dc.identifier.issue2
dc.identifier.scopus2-s2.0-84882402335
dc.identifier.spage99
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-84882402335&doi=10.1108%2f13565361311314502&partnerID=40&md5=8cb2e53c76b7e17d3b9688fd51c61165
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/29973
dc.identifier.volume30
dc.pagecount4
dc.sourceScopus
dc.sourcetitleMicroelectronics International
dc.subjectContamination
dc.subjectDecontamination
dc.subjectFlip chip
dc.subjectFlux cleaning
dc.subjectIonic contaminations
dc.subjectSolvents
dc.subjectWater-based solvent
dc.subjectChromatographic analysis
dc.subjectContamination
dc.subjectSolvents
dc.subjectContamination levels
dc.subjectDesign/methodology/approach
dc.subjectEnvironmental-friendly
dc.subjectFlip chip
dc.subjectFlip chip ball grid array
dc.subjectIonic contamination
dc.subjectLong term performance
dc.subjectWater based
dc.subjectDecontamination
dc.titleIonic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technologyen_US
dc.typeArticleen_US
dspace.entity.typePublication
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