Publication:
Effect of Needle Size and Needle Height to Substrate in Encapsulation Process of LED Packaging

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dc.contributor.authorAlim M.A.en_US
dc.contributor.authorAbdullah M.Z.en_US
dc.contributor.authorAziz M.S.A.en_US
dc.contributor.authorKamarudin R.en_US
dc.contributor.authorRusdi M.S.en_US
dc.contributor.authorIshak M.H.H.en_US
dc.contributor.authorGunnasegaran P.en_US
dc.contributor.authorid57527077400en_US
dc.contributor.authorid31567537400en_US
dc.contributor.authorid36695908700en_US
dc.contributor.authorid57215578097en_US
dc.contributor.authorid57193642841en_US
dc.contributor.authorid57189854965en_US
dc.contributor.authorid35778031300en_US
dc.date.accessioned2023-05-29T09:41:21Z
dc.date.available2023-05-29T09:41:21Z
dc.date.issued2022
dc.description.abstractThe purpose of this study is to investigate the effect of needle size and substrate to needle height by measuring the droplet volume and epoxy covered area in encapsulation process of LED packaging. Five needle gages (16G, 18G, 21G, 22G, and 23G) were used in this experiment. Average volume of epoxy drops was determined for each size of needle. Experimental data shows that droplet volumes are directly related with the needle diameter. Optimum covered area by the epoxy encapsulation was found at the needle tip to substrate distance at 3.240�mm for the 16G needle. These findings are relevant and helpful for controlling the amount of epoxy, encapsulation area, and the encapsulant shape in encapsulation process of LED packaging. � 2022, The Author(s), under exclusive license to Springer Nature Switzerland AG.en_US
dc.description.natureFinalen_US
dc.identifier.doi10.1007/978-3-030-92964-0_15
dc.identifier.epage156
dc.identifier.scopus2-s2.0-85126654443
dc.identifier.spage149
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-85126654443&doi=10.1007%2f978-3-030-92964-0_15&partnerID=40&md5=654eca2fb2e25b9c4613d46b4149704c
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/27234
dc.identifier.volume162
dc.publisherSpringer Science and Business Media Deutschland GmbHen_US
dc.sourceScopus
dc.sourcetitleAdvanced Structured Materials
dc.titleEffect of Needle Size and Needle Height to Substrate in Encapsulation Process of LED Packagingen_US
dc.typeBook Chapteren_US
dspace.entity.typePublication
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