Publication:
Reduction of warpage occurrence on stack-die QFN using FEA and statistical method

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dc.citedby0
dc.contributor.authorAbdullah I.en_US
dc.contributor.authorAhmad I.en_US
dc.contributor.authorTalib M.Z.M.en_US
dc.contributor.authorKamarudin M.N.B.C.en_US
dc.contributor.authorid24721493100en_US
dc.contributor.authorid12792216600en_US
dc.contributor.authorid8309925600en_US
dc.contributor.authorid57198018413en_US
dc.date.accessioned2023-12-29T07:55:18Z
dc.date.available2023-12-29T07:55:18Z
dc.date.issued2008
dc.description.abstractWarpage is greatly affected by package geometries, such as dimension of matrix array, pad, die and passive components as well as molding compound properties. It is also related to thermal mismatch i.e. coefficient of thermal expansion (CTE) and reliability of passive components in the package. So in order to reduce warpage occurrence in all packages, it is proposed that the combination of CTE properties of QFN packages layer need to be optimized. This study used finite element method (FEM) to perform extensive structural analysis of QFN package designs with respect to different combination of thermal properties and the possible occurrence of warpage. The results obtained were then verified with experimental data. The FEA method was able to simulate the warpage occurrence and the statistical method was able to identify the optimal combination of thermal properties of the layers. It was also found that the optimum combination of CTE properties will reduce the probability of the warpage occurrence.en_US
dc.description.natureFinalen_US
dc.identifier.ArtNo5507788
dc.identifier.doi10.1109/IEMT.2008.5507788
dc.identifier.scopus2-s2.0-77955102501
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-77955102501&doi=10.1109%2fIEMT.2008.5507788&partnerID=40&md5=c44922f883895d70c3aea6e559f18fb9
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/30887
dc.sourceScopus
dc.sourcetitleProceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium
dc.subjectDies
dc.subjectFinite element method
dc.subjectOptimization
dc.subjectPackaging
dc.subjectProbability density function
dc.subjectStatistics
dc.subjectStructural analysis
dc.subjectCoefficient of thermal expansion
dc.subjectCTE property
dc.subjectExperimental data
dc.subjectMatrix arrays
dc.subjectMolding compound
dc.subjectOptimal combination
dc.subjectOptimum combination
dc.subjectPackage geometries
dc.subjectPassive components
dc.subjectQFN package
dc.subjectThermal mismatch
dc.subjectThermal properties
dc.subjectWarpages
dc.subjectThermal expansion
dc.titleReduction of warpage occurrence on stack-die QFN using FEA and statistical methoden_US
dc.typeConference paperen_US
dspace.entity.typePublication
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