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Decay rate of the solutions to the Cauchy problem of the Lord Shulman thermoelastic Timoshenko model with distributed delay

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dc.citedby1
dc.contributor.authorChoucha A.en_US
dc.contributor.authorBoulaaras S.en_US
dc.contributor.authorJan R.en_US
dc.contributor.authorAlnegga M.en_US
dc.contributor.authorid57216493937en_US
dc.contributor.authorid36994353700en_US
dc.contributor.authorid57205596279en_US
dc.contributor.authorid57194856346en_US
dc.date.accessioned2025-03-03T07:48:02Z
dc.date.available2025-03-03T07:48:02Z
dc.date.issued2024
dc.description.abstractIn this study, we address a Cauchy problem within the context of the one-dimensional Timoshenko system, incorporating a distributed delay term. The heat conduction aspect is described by the Lord-Shulman theory. Our demonstration establishes that the dissipation resulting from the coupling of the Timoshenko system with Lord-Shulman?s heat conduction is sufficiently robust to stabilize the system, albeit with a gradual decay rate. To support our findings, we convert the system into a first-order form and, utilizing the energy method in Fourier space, and derive point wise estimates for the Fourier transform of the solution. These estimates, in turn, provide evidence for the slow decay of the solution. ? 2024 the author(s),en_US
dc.description.natureFinalen_US
dc.identifier.ArtNo20230143
dc.identifier.doi10.1515/dema-2023-0143
dc.identifier.issue1
dc.identifier.scopus2-s2.0-85187115361
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-85187115361&doi=10.1515%2fdema-2023-0143&partnerID=40&md5=fef74db836b55f6245c1d68f2d543d9f
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/37152
dc.identifier.volume57
dc.publisherWalter de Gruyter GmbHen_US
dc.relation.ispartofAll Open Access; Gold Open Access
dc.sourceScopus
dc.sourcetitleDemonstratio Mathematica
dc.titleDecay rate of the solutions to the Cauchy problem of the Lord Shulman thermoelastic Timoshenko model with distributed delayen_US
dc.typeArticleen_US
dspace.entity.typePublication
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