Publication: Preliminary study to determine the maximum settling velocity and model parameter of Cu nanoparticle by settling method
dc.citedby | 1 | |
dc.contributor.author | Azman A. | en_US |
dc.contributor.author | Yusoff M.Z. | en_US |
dc.contributor.author | Hassan M.Z. | en_US |
dc.contributor.author | Yazid H. | en_US |
dc.contributor.author | Gunnasegaran P. | en_US |
dc.contributor.author | Ng K.C. | en_US |
dc.contributor.authorid | 24075556300 | en_US |
dc.contributor.authorid | 7003976733 | en_US |
dc.contributor.authorid | 57196039297 | en_US |
dc.contributor.authorid | 22137189500 | en_US |
dc.contributor.authorid | 35778031300 | en_US |
dc.contributor.authorid | 55310814500 | en_US |
dc.date.accessioned | 2023-05-29T08:09:57Z | |
dc.date.available | 2023-05-29T08:09:57Z | |
dc.date.issued | 2020 | |
dc.description.abstract | Nanoparticle suspensions also known as nanofluids are often polydisperse and tend to settle with time. Its settling process is very challenging and quite complexs to understand. In this study, Copper (Cu)nanoparticles were dispersed in base fluid (water) and the settling behaviour were examined to obtain the settlement parameter. A series of experiments adopted from sludge settling methods were conducted and the results were analysed. Based on the experiments, the settling curve was successfully established. � Published under licence by IOP Publishing Ltd. | en_US |
dc.description.nature | Final | en_US |
dc.identifier.ArtNo | 12026 | |
dc.identifier.doi | 10.1088/1757-899X/785/1/012026 | |
dc.identifier.issue | 1 | |
dc.identifier.scopus | 2-s2.0-85088104674 | |
dc.identifier.uri | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85088104674&doi=10.1088%2f1757-899X%2f785%2f1%2f012026&partnerID=40&md5=465122c4e13eb9ca20642e626ed6dc25 | |
dc.identifier.uri | https://irepository.uniten.edu.my/handle/123456789/25481 | |
dc.identifier.volume | 785 | |
dc.publisher | Institute of Physics Publishing | en_US |
dc.relation.ispartof | All Open Access, Bronze | |
dc.source | Scopus | |
dc.sourcetitle | IOP Conference Series: Materials Science and Engineering | |
dc.title | Preliminary study to determine the maximum settling velocity and model parameter of Cu nanoparticle by settling method | en_US |
dc.type | Conference Paper | en_US |
dspace.entity.type | Publication |