Publication:
Study on reliability test of die attach material

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dc.citedby1
dc.contributor.authorYik L.C.en_US
dc.contributor.authorKar Y.B.en_US
dc.contributor.authorShafika N.en_US
dc.contributor.authorid55787504300en_US
dc.contributor.authorid26649255900en_US
dc.contributor.authorid55786831000en_US
dc.date.accessioned2023-12-28T06:30:24Z
dc.date.available2023-12-28T06:30:24Z
dc.date.issued2012
dc.description.abstractSilver plated copper is a new developed die attachment material to replace pure silver. As year past, price of silver getting higher and become a problem for those semiconductors packaging company. Therefore, silver plated copper was developed as new die attachment material to solve the costing problem. But the characteristic and reliability of silver plated copper filler has be a doubt to replace the pure silver in the market. This paper will review few test method to test on the reliability of silver plated copper filler and proved that it is as good as silver to be the filler. � 2012 IEEE.en_US
dc.description.natureFinalen_US
dc.identifier.ArtNo6521776
dc.identifier.doi10.1109/IEMT.2012.6521776
dc.identifier.scopus2-s2.0-84879853139
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-84879853139&doi=10.1109%2fIEMT.2012.6521776&partnerID=40&md5=e78d451874fd582012de2c1aa00d2661
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/29533
dc.sourceScopus
dc.sourcetitleProceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium
dc.subjectcopper
dc.subjectfiller
dc.subjectreliability
dc.subjectsilver
dc.subjecttest method
dc.subjectFillers
dc.subjectIndustrial electronics
dc.subjectManufacture
dc.subjectReliability
dc.subjectSilver
dc.subjectSilver plating
dc.subjectTesting
dc.subjectDie attachment
dc.subjectDie-attach materials
dc.subjectPackaging companies
dc.subjectReliability test
dc.subjectTest method
dc.subjectCopper
dc.titleStudy on reliability test of die attach materialen_US
dc.typeConference paperen_US
dspace.entity.typePublication
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