Study of Composite Material Between Epoxy with Solid Glass Microsphere and Kenaf Composite

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Muhammad Danial Bin Aziz
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This thesis reports describes the optimize the best ratio for material undergoes by two testing which is thermal conductivity and dielectric. One of the aimed of this research was to fabricate epoxy and hardener, Solid Glass Microsphere (SGM) and kenaf. After all materials been fabricated next, the purpose for this experiment to measure the thermal conductivity of different ratio epoxy filled with Solid Glass Microsphere (SGM) composite and kenaf. and measure the dielectric of different ratio epoxy filled with Solid Glass Microsphere (SGM) composite and kenaf. A thorough survey of the distributed writing reveals that no research has yet provided information on the dielectric behaviour of epoxy and SGM composite for warm conductivity in which some reports are discovered, this undertaking is to explore the composite characteristics, such as thermal conductivity as well as dielectric properties of epoxy / SGM composite. For this project, it will done with a 50 mm PVC pipe to produce composite material, and blend the epoxy with tougher, solid glass microsphere and kenaf by following the actual desire ratio. Then allow the epoxy to dry within 24 hours and then test whether the material has dried or not to cut with 25 mm using mini pipe sighted diameter for each ratio required 3 specimens for each sample. After done this experiment what we can conclude that The Epoxy 100% is the less strength of the composite material towards the higher temperature. This effects were due to the addition of glass microspheres to the epoxy resins and thus inducing the charge migration, resulting in the composites reducing the dielectric constant.
ASTM , Solid Gas Microsphere (SGM) , CTE