Publication:
The impact of various nanofluid types on triangular microchannels heat sink cooling performance

dc.citedby105
dc.contributor.authorMohammed H.A.en_US
dc.contributor.authorGunnasegaran P.en_US
dc.contributor.authorShuaib N.H.en_US
dc.contributor.authorid15837504600en_US
dc.contributor.authorid35778031300en_US
dc.contributor.authorid13907934500en_US
dc.date.accessioned2023-12-29T07:49:03Z
dc.date.available2023-12-29T07:49:03Z
dc.date.issued2011
dc.description.abstractThis paper discusses the impact of using various types of nanofluids on heat transfer and fluid flow characteristics in triangular shaped microchannel heat sink (MCHS). In this study, an aluminum MCHS performance is examined using water as a base fluid with different types of nanofluids such as Al2O3, Ag, CuO, diamond, SiO2, and TiO2 as the coolants with nanoparticle volume fraction of 2%. The three-dimensional steady, laminar flow and heat transfer governing equations are solved using the finite volume method. It is inferred that diamond-H2O nanofluid has the lowest temperature and the highest heat transfer coefficient, while Al2O3-H2O nanofluid has the highest temperature and the lowest heat transfer coefficient. SiO2-H2O nanofluid has the highest pressure drop and wall shear stress while Ag-H2O nanofluid has the lowest pressure drop and wall shear stress among other nanofluid types. Based on the presented results, diamond-H2O and Ag-H2O nanofluids are recommended to achieve overall heat transfer enhancement and low pressure drop, respectively, compared with pure water. � 2011 Elsevier Ltd.en_US
dc.description.natureFinalen_US
dc.identifier.doi10.1016/j.icheatmasstransfer.2011.03.024
dc.identifier.epage773
dc.identifier.issue6
dc.identifier.scopus2-s2.0-79957874230
dc.identifier.spage767
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-79957874230&doi=10.1016%2fj.icheatmasstransfer.2011.03.024&partnerID=40&md5=7b8167eed8353320310f68fafb381959
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/30536
dc.identifier.volume38
dc.pagecount6
dc.sourceScopus
dc.sourcetitleInternational Communications in Heat and Mass Transfer
dc.subjectHeat transfer enhancement
dc.subjectNanofluids
dc.subjectNumerical simulation
dc.subjectTriangular microchannel heat sink
dc.subjectDiamonds
dc.subjectFinite volume method
dc.subjectHeat sinks
dc.subjectHeat transfer coefficients
dc.subjectLaminar flow
dc.subjectMicrochannels
dc.subjectNumerical methods
dc.subjectPressure drop
dc.subjectShear stress
dc.subjectSilicon compounds
dc.subjectSilver
dc.subjectTitanium dioxide
dc.subjectCooling performance
dc.subjectFlow and heat transfer
dc.subjectGoverning equations
dc.subjectHeat transfer and fluid flow
dc.subjectHeat Transfer enhancement
dc.subjectHighest temperature
dc.subjectLow pressure drop
dc.subjectMicro channel heat sinks
dc.subjectNano-fluid
dc.subjectNanofluids
dc.subjectNumerical simulation
dc.subjectPure water
dc.subjectTiO
dc.subjectTriangular microchannels
dc.subjectWall shear stress
dc.subjectNanofluidics
dc.titleThe impact of various nanofluid types on triangular microchannels heat sink cooling performanceen_US
dc.typeArticleen_US
dspace.entity.typePublication
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