Publication:
Manufacturability readiness of insulated Cu wire bonding process in PBGA package

Simple item page
dc.contributor.authorHungyang L.en_US
dc.contributor.authorBoonkar Y.en_US
dc.contributor.authorYong T.C.en_US
dc.contributor.authorKhan N.en_US
dc.contributor.authorIbrahim M.R.en_US
dc.contributor.authorTan L.C.en_US
dc.contributor.authorid56535329100en_US
dc.contributor.authorid26649255900en_US
dc.contributor.authorid16029485400en_US
dc.contributor.authorid9736201900en_US
dc.contributor.authorid16021986000en_US
dc.contributor.authorid57661553500en_US
dc.date.accessioned2023-05-16T02:46:09Z
dc.date.available2023-05-16T02:46:09Z
dc.date.issued2014
dc.description.abstractToday, microelectronics devices are getting smaller with more I/Os. Conventional ultra fine pitch wire bonding is facing wire-to wire short and wire sweeping issues. The use of insulated Cu wire is a potential technology enabling greater wire density, and wires touching and crossing, as the wire is coated with a layer or organic coating to prevent wire-to-wire short. In this paper we analyze the reliability of insulated Cu wire with diameter of 20 ?m in PBGA package under unbiased HAST, TC and HTS reliability stressing using standard, touched wires profile and extreme loop height without kinks profile. Ball shear, wire pull and stitch pull tests as well as Cu/Al IMC thickness measurement test w performed after reliability stressing for bare Cu and insulated Cu wire samples. Results show that insulated Cu wire reliability samples show similar ball bond strength performance after the ball shear and wire pull test. Although stitch pull strength of insulated Cu is ?17% less than bare Cu samples, the reliability results indicate that insulated Cu stitch bond has good reliability. Effect of the capillary touchdowns to the ball and stitch bond integrity of bare Cu and insulated Cu wire bonding is also presented in this paper. Capillary residue build up on the tip surface was investigated. We found capillary condition and life are comparable to bare Cu wire capillary. © 2014 IEEE.en_US
dc.description.natureFinalen_US
dc.identifier.ArtNo7028288
dc.identifier.doi10.1109/EPTC.2014.7028288
dc.identifier.epage219
dc.identifier.scopus2-s2.0-84946693646
dc.identifier.spage215
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-84946693646&doi=10.1109%2fEPTC.2014.7028288&partnerID=40&md5=943508fd7591cd3a638710ccc852a488
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/21934
dc.publisherInstitute of Electrical and Electronics Engineers Inc.en_US
dc.sourceScopus
dc.sourcetitleProceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014
dc.titleManufacturability readiness of insulated Cu wire bonding process in PBGA packageen_US
dc.typeConference Paperen_US
dspace.entity.typePublication
Files
Collections
SCOPUS