Publication:
Effect of Current Stressing on Mixed Solder Joint Resistance and Temperature

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dc.citedby0
dc.contributor.authorZulkifli M.N.en_US
dc.contributor.authorAbdullah I.en_US
dc.contributor.authorAzam M.F.A.en_US
dc.contributor.authorAzhan N.H.en_US
dc.contributor.authorAhmed A.en_US
dc.contributor.authorJalar A.en_US
dc.contributor.authorid36703431600en_US
dc.contributor.authorid57224607172en_US
dc.contributor.authorid59472980000en_US
dc.contributor.authorid56652239100en_US
dc.contributor.authorid59472471400en_US
dc.contributor.authorid11539926200en_US
dc.date.accessioned2025-03-03T07:45:35Z
dc.date.available2025-03-03T07:45:35Z
dc.date.issued2024
dc.description.abstractThis paper aims to investigate the impact of current stress on the electrical performance of mixed solder joints made of SnPb with SnCu and SnPb with SAC305. This information is currently missing and requires further research. The resistance of current-stressed pin-through-hole (PTH) solder joints, namely SnPb, SnCu, SAC305, and mixed solder joints of SnPb/SnCu and SnPb/SAC305, was measured using a micro-Ohm meter based on the Kelvin method. Temperature measurements were conducted by attaching two thermocouple probes to the solder joints. A microstructure examination was performed on the cross-section sample of PTH solder joints and further analyzed using open-source image processing software, ImageJ. It is noteworthy that fully mixing leaded and lead-free solder can reduce the variation of resistance during the application of current. The resistances of SnCu solder joints vary more compared to those of SAC305 joints with increasing applied current. Resistance variation of the SnPb/SnCu mixed solder joint is more dominant towards the SnPb solder joint trend, whereas SnPb/ SAC305 mixed solder joint is more dominant towards the SAC305 solder joint trend. The findings obtained from the ImageJ software analysis can be utilized to examine the evolution of microstructure and its correlation with the electrical properties of mixed solder joints. ? This is an open access article under the CC BY-NC-SA 4.0 licenseen_US
dc.description.natureFinalen_US
dc.identifier.doi10.30880/ijie.2024.16.07.008
dc.identifier.epage90
dc.identifier.issue7
dc.identifier.scopus2-s2.0-85212043358
dc.identifier.spage83
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-85212043358&doi=10.30880%2fijie.2024.16.07.008&partnerID=40&md5=f2585d5bf893fb0050216605d11e569c
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/36897
dc.identifier.volume16
dc.pagecount7
dc.publisherPenerbit UTHMen_US
dc.sourceScopus
dc.sourcetitleInternational Journal of Integrated Engineering
dc.titleEffect of Current Stressing on Mixed Solder Joint Resistance and Temperatureen_US
dc.typeArticleen_US
dspace.entity.typePublication
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