Publication:
The effect of clean and no-clean flux in enhancing the wettability of eutectic solder bump flip chip PBGA

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dc.citedby4
dc.contributor.authorAmin N.en_US
dc.contributor.authorCheah A.Y.en_US
dc.contributor.authorKornain Z.en_US
dc.contributor.authorAhmad I.en_US
dc.contributor.authorid7102424614en_US
dc.contributor.authorid26632778200en_US
dc.contributor.authorid24341024000en_US
dc.contributor.authorid12792216600en_US
dc.date.accessioned2023-12-29T07:57:22Z
dc.date.available2023-12-29T07:57:22Z
dc.date.issued2008
dc.description.abstractFive different types of clean flux and no-clean flux, which are mainly used in flip chip die attach, have been analyzed in respect to the wettability of eutectic solder bump in flip chip PBGA. An experimental study is carried out to measure the spreading area of the eutectic solder bump processed with different types of flux. Various types of clean and no-clean flux are measured and placed on top of silicon die. The effect of the flux has been observed by measuring the spreading area of the eutectic solder bump processed with different types of clean and no-clean fluxes by using Leica Quin Colour (RGB) after the heat treatment. Comparative studies on clean and no-clean fluxes are therefore obtained. Clean flux has shown better wettability on the high lead solder pad proving it to be the optimum choice as also supported by the die pull results. Moreover, the fluxes are tested under thermal gravimetric analyzer (TGA) to observe the flux weight loss on the melting point of eutectic solder bump to correlate with the earlier results. � 2008 IEEE.en_US
dc.description.natureFinalen_US
dc.identifier.ArtNo4770347
dc.identifier.doi10.1109/SMELEC.2008.4770347
dc.identifier.epage397
dc.identifier.scopus2-s2.0-65949110148
dc.identifier.spage393
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-65949110148&doi=10.1109%2fSMELEC.2008.4770347&partnerID=40&md5=43e5e9ff570efe203cd5b4b895d19a58
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/30989
dc.pagecount4
dc.sourceScopus
dc.sourcetitleIEEE International Conference on Semiconductor Electronics, Proceedings, ICSE
dc.subjectBrazing
dc.subjectDies
dc.subjectElectronics packaging
dc.subjectEutectics
dc.subjectLead
dc.subjectMelting point
dc.subjectWelding
dc.subjectComparative studies
dc.subjectEutectic solders
dc.subjectExperimental studies
dc.subjectFlip chip dies
dc.subjectFlip chip PBGA
dc.subjectHigh Lead Solder
dc.subjectSilicon die
dc.subjectThermal gravimetric analyzer
dc.subjectWeight loss
dc.subjectSoldering alloys
dc.titleThe effect of clean and no-clean flux in enhancing the wettability of eutectic solder bump flip chip PBGAen_US
dc.typeConference paperen_US
dspace.entity.typePublication
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