Publication:
Numerical study on the effects of using nanofluids in pulsating heat pipe

dc.citedby2
dc.contributor.authorZufar M.en_US
dc.contributor.authorGunnasegaran P.en_US
dc.contributor.authorChing N.K.en_US
dc.contributor.authorid57205240082en_US
dc.contributor.authorid35778031300en_US
dc.contributor.authorid55310814500en_US
dc.date.accessioned2023-05-29T06:55:07Z
dc.date.available2023-05-29T06:55:07Z
dc.date.issued2018
dc.description.abstractPulsating Heat Pipe (PHP) is the next generation heat pipe that has a prospect in improving the heat transfer performance. The type of working fluid use in the PHP has a direct influence on the thermal performance. Incorporating nanofluid in PHP may greatly increase its thermal performance as compared to using base fluid (water). The current work focuses on the simulations of 2-dimensional flows in PHP using working fluids such as diamond, silver (Ag), silica oxide (SiO 2 ) nanofluids and water. Constant heat flux and filling ratio of 50% were used throughout the study. From the results, it was found out that diamond nanofluid has the lowest thermal resistance value as compared to other working fluids. The effect of the number of PHP turns was studied and it was discovered that higher number of turns would produce lower thermal resistance value. � 2018 Authors.en_US
dc.description.natureFinalen_US
dc.identifier.doi10.14419/ijet.v7i4.35.22732
dc.identifier.epage209
dc.identifier.issue4
dc.identifier.scopus2-s2.0-85059230361
dc.identifier.spage204
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-85059230361&doi=10.14419%2fijet.v7i4.35.22732&partnerID=40&md5=5895c805f4c9d53d80f1877d12944401
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/24076
dc.identifier.volume7
dc.publisherScience Publishing Corporation Incen_US
dc.relation.ispartofAll Open Access, Bronze, Green
dc.sourceScopus
dc.sourcetitleInternational Journal of Engineering and Technology(UAE)
dc.titleNumerical study on the effects of using nanofluids in pulsating heat pipeen_US
dc.typeArticleen_US
dspace.entity.typePublication
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