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Solder ball robustness study on polymer core solder balls for BGA packages

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dc.citedby2
dc.contributor.authorKar Y.B.en_US
dc.contributor.authorHui T.C.en_US
dc.contributor.authorAgileswarien_US
dc.contributor.authorLo C.en_US
dc.contributor.authorid26649255900en_US
dc.contributor.authorid55340767200en_US
dc.contributor.authorid16023154400en_US
dc.contributor.authorid55340865500en_US
dc.date.accessioned2023-12-28T06:30:09Z
dc.date.available2023-12-28T06:30:09Z
dc.date.issued2012
dc.description.abstractRestriction of Hazardous Substance (RoHS) Regulation came into effect in 2006 due to the hazardous effects of lead to human's health and toxicity for environment. As such, the leaded solder ball was replaced by lead-free solder ball which is now widely used in semiconductor industries. However, there was a concern on the robustness of lead-free solder ball especially on drop ball issues when compared to lead solder ball, especially when subjected to reliability stress tests. The polymer core solder ball was invented to solve the drop ball issue. Polymer core solder ball with an additional polymer core inside the solder functions as a stress buffer to dissipate stress better compared to the current conventional lead-free solder ball. However, a new problem arises which is the formation of Kirkendall voids in between the Copper (Cu) and solder interface which results in poor reliability performance. This formation of voids could be due to the faster diffusion from Cu to Tin (Sn) than Sn to Cu. Therefore, an additional Nickel (Ni) layer is coated on top of Cu to overcome this problem. The function of Ni is to limit / reduce the diffusion from Cu to Sn thus preventing the formation of Kirkendall voids. This enhances the robustness of the solder ball joint. The solder ball shear strength test and tray drop test were conducted in this research study under different reliability stress conditions such as temperature cycle (TC) and high temperature storage (HTS) stress to verify the robustness and the reliability of the polymer core solder balls. The solder ball shear strength experiment was conducted via Dage 4000 series bond tester and drop reliability test was carried out via the tray drop test. It is observed that the shear strength for polymer core solder ball without Ni coating layer decreased in TC and HTS stress condition and the tray drop test reliability is the worst in HTS 1008 hours. This is due to the excessive formation of Kirkendall voids resulting from the faster diffusion rate from Cu to Sn than Sn to Cu. From this research study, it can be concluded that the polymer core solder ball with an additional of Ni coating layer gives higher joint strength and better drop reliability performance compared to the polymer core solder ball without additional Ni coating layer. � 2012 IEEE.en_US
dc.description.natureFinalen_US
dc.identifier.ArtNo6521760
dc.identifier.doi10.1109/IEMT.2012.6521760
dc.identifier.scopus2-s2.0-84879858675
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-84879858675&doi=10.1109%2fIEMT.2012.6521760&partnerID=40&md5=806758fbf179b4235aa8ebc31557075b
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/29469
dc.sourceScopus
dc.sourcetitleProceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium
dc.subjectCoatings
dc.subjectDrops
dc.subjectHazardous materials
dc.subjectIndustrial electronics
dc.subjectLead
dc.subjectManufacture
dc.subjectNickel
dc.subjectPolymers
dc.subjectReliability
dc.subjectSemiconductor device manufacture
dc.subjectSoldered joints
dc.subjectSoldering alloys
dc.subjectTesting
dc.subjectTin
dc.subjectDrop test reliability
dc.subjectHigh temperature storage
dc.subjectPolymer core solder balls
dc.subjectReliability performance
dc.subjectRestriction of hazardous Substances
dc.subjectRobustness studies
dc.subjectSemiconductor industry
dc.subjectTemperature cycles
dc.subjectSoldering
dc.titleSolder ball robustness study on polymer core solder balls for BGA packagesen_US
dc.typeConference paperen_US
dspace.entity.typePublication
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