Publication:
Ultra fine pitch 20 micron 2N second bond improvement with new capillary surface morphology

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dc.citedby0
dc.contributor.authorNor N.H.M.en_US
dc.contributor.authorTaib S.en_US
dc.contributor.authorAhmad I.en_US
dc.contributor.authorAbdullah H.en_US
dc.contributor.authorid57219925855en_US
dc.contributor.authorid26633364600en_US
dc.contributor.authorid12792216600en_US
dc.contributor.authorid26025061200en_US
dc.date.accessioned2023-12-29T07:57:39Z
dc.date.available2023-12-29T07:57:39Z
dc.date.issued2008
dc.description.abstractWire bonding of 20micron 2N wire using conventional pink capillary for ultra Fine Pitch package results in high stoppages of short tail which causes machine to stop, higher yield loss and reduced equipment efficiency and stability. The objective of present study is to improve the 2nd bond quality and stability for reducing the stoppages caused by the short tail. The new design, called as Fortus capillaries have granular tip surface morphology that improves mechanical interlocking, relative displacement between capillary's tip and wire, and also improve the energy transfer efficiency at wire-lead inter layer surface. Statistical analysis comparisons and internal physical inspection were done through SEM image at 0 hour, 96 hours and 192 hours after High Temperature Storage (HTS) and 500 and 1000x Thermal cycle. Cross section analysis was also done to study the Inter Metallic Compound (IMC) formation between wire and lead plating. The Fortus pink capillary effectiveness in reducing short tail was proven in actual production during 5000 unit wire bond process operation with 75% improvement of machine stoppages and resulting in significant improvement of production yield up to 99.5%. This new granular tip capillary also gave about 100% improvement compared to the conventional capillaries life �2008 IEEE.en_US
dc.description.natureFinalen_US
dc.identifier.ArtNo4770351
dc.identifier.doi10.1109/SMELEC.2008.4770351
dc.identifier.epage409
dc.identifier.scopus2-s2.0-65949083325
dc.identifier.spage406
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-65949083325&doi=10.1109%2fSMELEC.2008.4770351&partnerID=40&md5=7e7485bb677e54f6f5bbe4280c90b489
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/31000
dc.pagecount3
dc.sourceScopus
dc.sourcetitleIEEE International Conference on Semiconductor Electronics, Proceedings, ICSE
dc.subjectCapillarity
dc.subjectElectric batteries
dc.subjectElectronics packaging
dc.subjectElectroplating
dc.subjectEnergy transfer
dc.subjectHigh temperature superconductors
dc.subjectLead compounds
dc.subjectLead plating
dc.subjectMetallic compounds
dc.subjectMorphology
dc.subjectSurface analysis
dc.subjectWire
dc.subjectAfter high temperature
dc.subjectBond quality
dc.subjectCross-section analysis
dc.subjectEnergy transfer efficiency
dc.subjectEquipment efficiency
dc.subjectHigher yield
dc.subjectInter-layers
dc.subjectMechanical interlocking
dc.subjectNew design
dc.subjectPhysical inspection
dc.subjectProduction yield
dc.subjectRelative displacement
dc.subjectSEM image
dc.subjectStatistical analysis
dc.subjectThermal cycle
dc.subjectUltra fine pitch
dc.subjectWire bonding
dc.subjectWire bonds
dc.subjectSurface morphology
dc.titleUltra fine pitch 20 micron 2N second bond improvement with new capillary surface morphologyen_US
dc.typeConference paperen_US
dspace.entity.typePublication
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